{"title":"利用TCAD仿真研究保护电源器件的性能","authors":"F. Roqueta, K. Tahri","doi":"10.1109/EUROSIME.2013.6529904","DOIUrl":null,"url":null,"abstract":"The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.","PeriodicalId":270532,"journal":{"name":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"123 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Protection Power device performance investigation using TCAD simulations\",\"authors\":\"F. Roqueta, K. Tahri\",\"doi\":\"10.1109/EUROSIME.2013.6529904\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.\",\"PeriodicalId\":270532,\"journal\":{\"name\":\"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"123 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2013.6529904\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2013.6529904","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Protection Power device performance investigation using TCAD simulations
The paper presents a methodology for simulating the dynamic performances of a protection device used against EOS. Due to the coupling of electric and thermal phenomena occurring in the device during the EOS event, electro-thermal simulations are required. In order to obtain accurate description of the device behavior, component is simulated at different scales: 2D electrothermal simulation at device-scale and 3D thermal simulation at the package-scale. This approach allows to understand the behavior of the component and then to optimize it.
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