通过原位聚合合成弹性导电膜,用于在机械昆虫的活动附肢上安装可穿戴无创电子设备

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC npj Flexible Electronics Pub Date : 2023-09-01 DOI:10.1038/s41528-023-00274-z
Qifeng Lin, Rui Li, Feilong Zhang, Kazuki Kai, Zong Chen Ong, Xiaodong Chen, Hirotaka Sato
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引用次数: 0

摘要

利用昆虫的高机动性和体积小的特点,人们将昆虫与微控制器结合起来,制造出了各种实际应用的半机械昆虫。遗憾的是,目前所有的半机械昆虫都依靠植入电极来控制运动,这对它们的器官和肌肉造成了不可逆的损伤。为了解决上述问题,我们开发了一种非侵入性的半机械昆虫方法,使用一种带有原位聚合离子导电层和电子导电层的保形电极。昆虫对电感应的神经和运动反应验证了这种非侵入式方法在昆虫和控制器之间的高效通信。电子昆虫精确的 "S "线跟踪进一步证明了其在实际导航中的潜力。保形非侵入式电极在控制昆虫运动的同时保持了昆虫的完整性。由于保留了昆虫的触角和重要的嗅觉器官,半机械昆虫将来可能具有探测周围环境的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Resilient conductive membrane synthesized by in-situ polymerisation for wearable non-invasive electronics on moving appendages of cyborg insect
By leveraging their high mobility and small size, insects have been combined with microcontrollers to build up cyborg insects for various practical applications. Unfortunately, all current cyborg insects rely on implanted electrodes to control their movement, which causes irreversible damage to their organs and muscles. Here, we develop a non-invasive method for cyborg insects to address above issues, using a conformal electrode with an in-situ polymerized ion-conducting layer and an electron-conducting layer. The neural and locomotion responses to the electrical inductions verify the efficient communication between insects and controllers by the non-invasive method. The precise “S” line following of the cyborg insect further demonstrates its potential in practical navigation. The conformal non-invasive electrodes keep the intactness of the insects while controlling their motion. With the antennae, important olfactory organs of insects preserved, the cyborg insect, in the future, may be endowed with abilities to detect the surrounding environment.
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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