Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che Ani, Mohamad Riduwan Ramli
{"title":"SAC305 BGA 焊点热疲劳裂纹生长行为的数值研究","authors":"Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che Ani, Mohamad Riduwan Ramli","doi":"10.1108/ssmt-08-2023-0049","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.</p><!--/ Abstract__block -->\n<h3>Design/methodology/approach</h3>\n<p>The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.</p><!--/ Abstract__block -->\n<h3>Practical implications</h3>\n<p>This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.</p><!--/ Abstract__block -->","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"10 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2024-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints\",\"authors\":\"Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che Ani, Mohamad Riduwan Ramli\",\"doi\":\"10.1108/ssmt-08-2023-0049\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3>Purpose</h3>\\n<p>This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.</p><!--/ Abstract__block -->\\n<h3>Design/methodology/approach</h3>\\n<p>The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.</p><!--/ Abstract__block -->\\n<h3>Practical implications</h3>\\n<p>This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.</p><!--/ Abstract__block -->\\n<h3>Originality/value</h3>\\n<p>The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. 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Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints
Purpose
This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.
Design/methodology/approach
The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.
Findings
Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.
Practical implications
This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.
Originality/value
The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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