通过超材料匹配和先进的电磁曝光控制实现碳纤维增强聚合物的高能效微波固化

IF 1.4 4区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC International Journal of Microwave and Wireless Technologies Pub Date : 2024-01-26 DOI:10.1017/s1759078724000072
Yasin Alekajbaf, Suraj Murali, Dragos Dancila
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引用次数: 0

摘要

本研究提出了一种利用微波固化碳纤维增强聚合物(CFRP)的有效且可持续的技术。该方法包括在 CFRP 复合材料表面涂上一层金属共振涂层。接下来,复合材料被放置在一个多模腔内,多模腔用作涂抹器,由四个 250 W 固态功率放大器供电。为确保精确控制加热模式并实现复合材料的均匀加热,我们开发了一种复杂的控制算法。该算法可以独立调节每个功率放大器的相位、功率水平和频率。实验结果证实,所提出的方法能有效实现对 CFRP 微波固化过程的精确控制。
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Energy efficient microwave curing of carbon fiber reinforced polymer via metamaterial matching and advanced electromagnetic exposure control
This study proposed an effective and sustainable technique for the curing of carbon fiber reinforced polymers (CFRPs) using microwaves. The method involves applying a metallic resonance coating layer to envelop the CFRP composite’s surface. Next, the composite is positioned within a multi-mode cavity, which is used as an applicator, and is powered by four 250 W solid-state power amplifiers. To ensure precise control over the heating pattern and achieve uniform heating of the composite, a sophisticated control algorithm is developed. This algorithm can independently regulate the phase, power level, and frequency of each power amplifier. The experimental results confirm the effectiveness of this proposed approach in achieving precise control over the microwave-based curing process for CFRPs.
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来源期刊
International Journal of Microwave and Wireless Technologies
International Journal of Microwave and Wireless Technologies ENGINEERING, ELECTRICAL & ELECTRONIC-TELECOMMUNICATIONS
CiteScore
3.50
自引率
7.10%
发文量
130
审稿时长
6-12 weeks
期刊介绍: The prime objective of the International Journal of Microwave and Wireless Technologies is to enhance the communication between microwave engineers throughout the world. It is therefore interdisciplinary and application oriented, providing a platform for the microwave industry. Coverage includes: applied electromagnetic field theory (antennas, transmission lines and waveguides), components (passive structures and semiconductor device technologies), analogue and mixed-signal circuits, systems, optical-microwave interactions, electromagnetic compatibility, industrial applications, biological effects and medical applications.
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