用于熔融石英表面改性的基于中压 He/SF6/O2 的等离子体和湿化学蚀刻工艺的开发与性能演进

IF 2.6 3区 物理与天体物理 Q3 ENGINEERING, CHEMICAL Plasma Chemistry and Plasma Processing Pub Date : 2024-02-05 DOI:10.1007/s11090-024-10447-x
Hari Narayan Singh Yadav, Manas Das
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引用次数: 0

摘要

地面和空间天文仪器及其他科学仪器广泛使用的精密光学元件的需求日益增长,这就需要高效先进的制造方法。由于熔融石英基片表面形状复杂,如自由曲面或具有强曲率的非球面,或者元件尺寸非常小,因此开发了一种新型的非接触中压等离子体方法来抛光光学元件。本研究对采用中压等离子工艺和湿化学蚀刻法抛光的棱镜光学表面进行了严格比较,以深入了解其平滑程度。结果表明,在 5 毫巴和 20 毫巴总压力下,使用等离子工艺,表面粗糙度 (Ra) 分别从 0.54 纳米增加到 2.61 纳米和 0.53 纳米增加到 0.57 纳米,且无表面污染。然而,湿化学蚀刻会将表面粗糙度(Ra)从 0.52 纳米增加到 15.9 纳米。使用 FESEM、EDX 和 AFM 分析了基底的表面形态、元素组成和表面形貌。此外,还使用拉曼光谱分析法对亚表面的改进进行了分析。
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Development and Performance Evolution of Medium-Pressure He/SF6/O2-Based Plasma and Wet Chemical Etching Process for Surface Modification of Fused Silica

The rising demand for precision optics widely employed in ground and space-based astronomical instruments and other scientific instrumentation requires highly efficient advanced fabrication methods. Due to complex-shaped fused silica substrate surfaces like freeform or aspheres with strong curvatures or very small-sized components, a novel non-contact medium-pressure plasma-based method is developed to finish optical components. The present study critically compares the polished optical surfaces of a prism with a medium-pressure plasma process and wet chemical etching to provide insight into their smoothing. The results show that surface roughness (Ra) increases from 0.54 to 2.61 nm and 0.53 to 0.57 nm at 5 and 20 mbar total pressures, respectively, using a plasma process without surface contamination. However, wet chemical etching increases surface roughness (Ra) from 0.52 to 15.9 nm. The substrates' surface morphology, elemental composition, and surface topography are analyzed using FESEM, EDX, and AFM. Moreover, subsurface improvements are analyzed using Raman spectroscopy analysis.

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来源期刊
Plasma Chemistry and Plasma Processing
Plasma Chemistry and Plasma Processing 工程技术-工程:化工
CiteScore
5.90
自引率
8.30%
发文量
73
审稿时长
6-12 weeks
期刊介绍: Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.
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