Xinyi Jing , Keyu Luo , Kyung-Wook Paik , Peng He , Shuye Zhang
{"title":"利用蒙特卡罗方法模拟质子辐照损伤对锡银铜微凸块的影响","authors":"Xinyi Jing , Keyu Luo , Kyung-Wook Paik , Peng He , Shuye Zhang","doi":"10.1016/j.microrel.2024.115391","DOIUrl":null,"url":null,"abstract":"<div><p>The requirements for small size and high performance of electronic devices in space applications have made microbump technology a popular topic in current research. Based on the Monte Carlo method, using the SRIM program to simulate the irradiation effects on microbumps can effectively shorten the test period and avoid the chance problem of the actual test. Therefore, in this study, the SRIM program was used to simulate the atomic distribution and energy loss inside the microbump for different incident ions, incident energy, and incident angles. The results show that at the same incident energy and incident angle, ions with larger relative atomic mass are incident closer and cause more damage to the microbump. Meanwhile, in a certain range, the increase of incident energy significantly increases the damage inside the microbumps, but when the incident energy reaches a certain value, the damage instead appears to decrease to a certain extent due to the existence of Bragg's law. In addition, the incident distance and the range of energy release decrease with the increase of the incident angle.</p></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method\",\"authors\":\"Xinyi Jing , Keyu Luo , Kyung-Wook Paik , Peng He , Shuye Zhang\",\"doi\":\"10.1016/j.microrel.2024.115391\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The requirements for small size and high performance of electronic devices in space applications have made microbump technology a popular topic in current research. Based on the Monte Carlo method, using the SRIM program to simulate the irradiation effects on microbumps can effectively shorten the test period and avoid the chance problem of the actual test. Therefore, in this study, the SRIM program was used to simulate the atomic distribution and energy loss inside the microbump for different incident ions, incident energy, and incident angles. The results show that at the same incident energy and incident angle, ions with larger relative atomic mass are incident closer and cause more damage to the microbump. Meanwhile, in a certain range, the increase of incident energy significantly increases the damage inside the microbumps, but when the incident energy reaches a certain value, the damage instead appears to decrease to a certain extent due to the existence of Bragg's law. In addition, the incident distance and the range of energy release decrease with the increase of the incident angle.</p></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-04-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271424000714\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424000714","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method
The requirements for small size and high performance of electronic devices in space applications have made microbump technology a popular topic in current research. Based on the Monte Carlo method, using the SRIM program to simulate the irradiation effects on microbumps can effectively shorten the test period and avoid the chance problem of the actual test. Therefore, in this study, the SRIM program was used to simulate the atomic distribution and energy loss inside the microbump for different incident ions, incident energy, and incident angles. The results show that at the same incident energy and incident angle, ions with larger relative atomic mass are incident closer and cause more damage to the microbump. Meanwhile, in a certain range, the increase of incident energy significantly increases the damage inside the microbumps, but when the incident energy reaches a certain value, the damage instead appears to decrease to a certain extent due to the existence of Bragg's law. In addition, the incident distance and the range of energy release decrease with the increase of the incident angle.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.