利用蒙特卡罗方法模拟质子辐照损伤对锡银铜微凸块的影响

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Reliability Pub Date : 2024-04-12 DOI:10.1016/j.microrel.2024.115391
Xinyi Jing , Keyu Luo , Kyung-Wook Paik , Peng He , Shuye Zhang
{"title":"利用蒙特卡罗方法模拟质子辐照损伤对锡银铜微凸块的影响","authors":"Xinyi Jing ,&nbsp;Keyu Luo ,&nbsp;Kyung-Wook Paik ,&nbsp;Peng He ,&nbsp;Shuye Zhang","doi":"10.1016/j.microrel.2024.115391","DOIUrl":null,"url":null,"abstract":"<div><p>The requirements for small size and high performance of electronic devices in space applications have made microbump technology a popular topic in current research. Based on the Monte Carlo method, using the SRIM program to simulate the irradiation effects on microbumps can effectively shorten the test period and avoid the chance problem of the actual test. Therefore, in this study, the SRIM program was used to simulate the atomic distribution and energy loss inside the microbump for different incident ions, incident energy, and incident angles. The results show that at the same incident energy and incident angle, ions with larger relative atomic mass are incident closer and cause more damage to the microbump. Meanwhile, in a certain range, the increase of incident energy significantly increases the damage inside the microbumps, but when the incident energy reaches a certain value, the damage instead appears to decrease to a certain extent due to the existence of Bragg's law. In addition, the incident distance and the range of energy release decrease with the increase of the incident angle.</p></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method\",\"authors\":\"Xinyi Jing ,&nbsp;Keyu Luo ,&nbsp;Kyung-Wook Paik ,&nbsp;Peng He ,&nbsp;Shuye Zhang\",\"doi\":\"10.1016/j.microrel.2024.115391\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The requirements for small size and high performance of electronic devices in space applications have made microbump technology a popular topic in current research. Based on the Monte Carlo method, using the SRIM program to simulate the irradiation effects on microbumps can effectively shorten the test period and avoid the chance problem of the actual test. Therefore, in this study, the SRIM program was used to simulate the atomic distribution and energy loss inside the microbump for different incident ions, incident energy, and incident angles. The results show that at the same incident energy and incident angle, ions with larger relative atomic mass are incident closer and cause more damage to the microbump. Meanwhile, in a certain range, the increase of incident energy significantly increases the damage inside the microbumps, but when the incident energy reaches a certain value, the damage instead appears to decrease to a certain extent due to the existence of Bragg's law. In addition, the incident distance and the range of energy release decrease with the increase of the incident angle.</p></div>\",\"PeriodicalId\":51131,\"journal\":{\"name\":\"Microelectronics Reliability\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.6000,\"publicationDate\":\"2024-04-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Reliability\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0026271424000714\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424000714","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

太空应用中对电子设备小尺寸和高性能的要求,使微凸块技术成为当前研究的热门话题。基于蒙特卡罗方法,利用 SRIM 程序模拟辐照对微凸块的影响,可以有效缩短测试周期,避免实际测试中的偶然性问题。因此,本研究使用 SRIM 程序模拟了不同入射离子、入射能量和入射角度下微凸块内部的原子分布和能量损失。结果表明,在相同的入射能量和入射角度下,相对原子质量较大的离子入射距离更近,对微凸块造成的破坏也更大。同时,在一定范围内,入射能量的增加会显著增加微凸块内部的损伤,但当入射能量达到一定值时,由于布拉格定律的存在,损伤反而会出现一定程度的减小。此外,入射距离和能量释放范围随着入射角的增大而减小。
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Effect of proton irradiation damage on SnAg/Cu microbump simulation using Monte Carlo method

The requirements for small size and high performance of electronic devices in space applications have made microbump technology a popular topic in current research. Based on the Monte Carlo method, using the SRIM program to simulate the irradiation effects on microbumps can effectively shorten the test period and avoid the chance problem of the actual test. Therefore, in this study, the SRIM program was used to simulate the atomic distribution and energy loss inside the microbump for different incident ions, incident energy, and incident angles. The results show that at the same incident energy and incident angle, ions with larger relative atomic mass are incident closer and cause more damage to the microbump. Meanwhile, in a certain range, the increase of incident energy significantly increases the damage inside the microbumps, but when the incident energy reaches a certain value, the damage instead appears to decrease to a certain extent due to the existence of Bragg's law. In addition, the incident distance and the range of energy release decrease with the increase of the incident angle.

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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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