不同气流冲击应用对电子系统表面传热增量的研究

IF 1.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Journal of Engineering Thermophysics Pub Date : 2024-04-10 DOI:10.1134/S1810232824010120
D. E. Alnak, K. Karabulut
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引用次数: 0

摘要

摘要冲击射流技术是一种高性能冷却技术,适用于作为电子系统基本元件的微芯片,这些芯片体积小、发热量高。在这项研究中,我们探讨了如何通过空气冲击射流改善当今所有技术产品中使用的微型芯片的传热。为此,我们对铜板表面的冷却进行了数值研究,铜板表面有两种不同的形状,反三角形和反半圆形,在带有绝热表面的矩形横截面管道中具有 1000 W/m2 的恒定热通量,由一个和两个空气喷流冷却,两个空气喷流之间的距离分别为 D\(_{h}\) 和 2D\(_{h}\)。通过使用 Ansys-Fluent 计算机程序和 k-\(\varepsilon\) 湍流模型,对能量和纳维-斯托克斯方程进行了稳定的三维数值计算。所得结果与文献中的数值和实验研究结果进行了比较,结果表明两者是一致的。结果表明,在不同距离的单喷射通道和双喷射通道中,每个图案表面的平均 Nu 数和表面温度的变化都是不同的。对于两种图案表面,我们评估了不同H/D(_{h}\)比和射流数下射流沿通道的流线和温度等值线分布。与 D\(_{h}\) 相比,在 H/D\(_{h}\) = 12 和 Re = 11,000 时,双射流和 2D\(_{h}\) 距离通道中,第一排反三角和半圆图案表面的 Nu 数分别增加了 67% 和 65.9%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Investigation of Heat Transfer Increment in Electronic System Surfaces by Different Air Jet Impingement Applications

The impinging jet technique is a high-performance cooling technology for microchips which are basic elements of electronic systems and having high heat generation rates in small volumes. In this study, the improvement of heat transfer of the microchips used in all technological products today by air impinging jet has been examined. For this purpose, numerical research has been carried out on the cooling of copper plate surfaces with two different patterns, reverse triangle and reverse semi-circle shaped having 1000 W/m2 constant heat flux in rectangular cross-section ducts with adiabatic surfaces, by one and double air jets with distances of D\(_{h}\) and 2D\(_{h}\) between them. Numerical computation has been performed for energy and Navier–Stokes equations as steady and three-dimensional by employing the Ansys-Fluent computer program with the k-\(\varepsilon\) turbulence model. The obtained results have been compared with the numerical and experimental results of the study in the literature and it has been seen that they are compatible with each other. The results have been presented as the mean Nu number and the variation of surface temperature for each of both patterned surfaces in single and double jet channels with different distances. Streamline and temperature contour distributions of the jet flow along the channel for different H/D\(_{h}\) ratios and jet numbers have been evaluated for both patterned surfaces. In double-jet and 2D\(_{h}\) distance channels compared to D\(_{h}\), at H/D\(_{h}\) = 12 and Re = 11,000, the Nu number increases of 67% and 65.9% have been observed on the first-row reverse triangle and semi-circular patterned surfaces, respectively.

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来源期刊
Journal of Engineering Thermophysics
Journal of Engineering Thermophysics THERMODYNAMICS-ENGINEERING, MECHANICAL
CiteScore
2.30
自引率
12.50%
发文量
0
审稿时长
3 months
期刊介绍: Journal of Engineering Thermophysics is an international peer reviewed journal that publishes original articles. The journal welcomes original articles on thermophysics from all countries in the English language. The journal focuses on experimental work, theory, analysis, and computational studies for better understanding of engineering and environmental aspects of thermophysics. The editorial board encourages the authors to submit papers with emphasis on new scientific aspects in experimental and visualization techniques, mathematical models of thermophysical process, energy, and environmental applications. Journal of Engineering Thermophysics covers all subject matter related to thermophysics, including heat and mass transfer, multiphase flow, conduction, radiation, combustion, thermo-gas dynamics, rarefied gas flow, environmental protection in power engineering, and many others.
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