增强双活性层非晶 SiZnSnO/SiInZnO 薄膜晶体管的电气性能

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Solid-state Electronics Pub Date : 2024-05-09 DOI:10.1016/j.sse.2024.108952
Sandeep Kumar Maurya, Sang Yeol Lee
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引用次数: 0

摘要

双层薄膜晶体管(TFT)的沟道结构包括电介质层、半导体非晶-Si-In-Zn-O(a-SIZO)层和半导体非晶-Si-Zn-Sn-O(a-SZTO)层,旨在提高场效应迁移率和稳定性。这些薄膜是在室温下通过射频溅射沉积而成的。在 500 °C 温度下处理的底栅顶部接触 TFT 显示出很高的迁移率(32 cm2 V-1 s-1),电流导通/关断比约为 108,阈下摆幅(SS)值低于 0.5 V 十年-1,这主要是由于陷阱密度降低以及存在高导电性超薄 a-SIZO 层。此外,双层 TFT 在负偏压和正偏压温度应力条件下均表现出显著的稳定性。
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Enhancement in electrical properties of dual-active-layer amorphous SiZnSnO/SiInZnO thin film transistors

Bi-layer thin film transistors (TFTs) have been fabricated with a channel structure comprising a dielectric layer, a semiconducting amorphous-Si-In-Zn-O (a-SIZO) layer, and a semiconducting amorphous-Si-Zn-Sn-O (a-SZTO) layer, aiming to improve field effect mobility and stability. These films were deposited using RF sputtering at room temperature. The TFTs with a bottom gate top contact, processed at 500 °C, exhibited high mobilities (>32 cm2 V−1 s−1) along with a current on/off ratio of approximately 108 and a subthreshold swing (SS) value below 0.5 V decade−1 primarily because of reduced trap density and presence of highly conducting ultrathin a-SIZO layer. Furthermore, the bi-layer TFTs demonstrated notable stability under negative and positive bias temperature stress conditions.

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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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