{"title":"等温老化过程中 Sn15Bi-xAg\\Cu 焊点的微观结构和力学行为","authors":"Fengjiang Wang, Dapeng Yang, Guoqing Yin","doi":"10.1108/ssmt-10-2023-0058","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>This paper aims to focus on the reliability of Sn15Bi–<em>x</em>Ag and Sn15Bi–<em>x</em>Cu solder joints during isothermal aging.</p><!--/ Abstract__block -->\n<h3>Design/methodology/approach</h3>\n<p>The effects of Ag or Cu additions on the microstructure, interfacial metallic compound layer and shear strength of Sn–15Bi (Sn15Bi) based solder joints during were investigated. The effects of Ag or Cu additions on the microstructure and tensile properties of Sn15Bi-based bulk solders were also investigated to provide a comprehensive analysis. The interfacial morphology and microstructure were observed by scanning electron microscopy and the composition in the structure was examined by energy dispersive spectrometer. 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The effects of Ag or Cu additions on the microstructure and tensile properties of Sn15Bi-based bulk solders were also investigated to provide a comprehensive analysis. The interfacial morphology and microstructure were observed by scanning electron microscopy and the composition in the structure was examined by energy dispersive spectrometer. The shear tests were carried out on the as-soldered and as-aged joints using a ball shear tester.</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>The results revealed that by adding Ag or Cu, the microstructure of Sn15Bi solder can be refined. Ag addition increased the tensile strength of Sn15Bi solder but had little effect on elongation. However, Cu addition decreased the tensile strength and elongation of Sn15Bi solder. 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引用次数: 0
摘要
设计/方法/途径 研究了添加 Ag 或 Cu 对 Sn15Bi（Sn15Bi）基焊点的微观结构、界面金属化合物层和剪切强度的影响。为了提供全面的分析，还研究了添加 Ag 或 Cu 对 Sn15Bi 基散装焊料的微观结构和拉伸性能的影响。用扫描电子显微镜观察了界面形态和微观结构，并用能量色散光谱仪检测了结构中的成分。结果表明，通过添加 Ag 或 Cu，锡 15Bi 焊料的微观结构可以得到改善。添加银提高了 Sn15Bi 焊料的抗拉强度，但对伸长率影响不大。然而，添加铜会降低 Sn15Bi 焊料的抗拉强度和伸长率。在焊点方面，添加银提高了 Sn15Bi/Cu 焊点的剪切强度和韧性，但添加铜降低了 Sn15Bi/Cu 焊点的剪切强度和韧性。
Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging
Purpose
This paper aims to focus on the reliability of Sn15Bi–xAg and Sn15Bi–xCu solder joints during isothermal aging.
Design/methodology/approach
The effects of Ag or Cu additions on the microstructure, interfacial metallic compound layer and shear strength of Sn–15Bi (Sn15Bi) based solder joints during were investigated. The effects of Ag or Cu additions on the microstructure and tensile properties of Sn15Bi-based bulk solders were also investigated to provide a comprehensive analysis. The interfacial morphology and microstructure were observed by scanning electron microscopy and the composition in the structure was examined by energy dispersive spectrometer. The shear tests were carried out on the as-soldered and as-aged joints using a ball shear tester.
Findings
The results revealed that by adding Ag or Cu, the microstructure of Sn15Bi solder can be refined. Ag addition increased the tensile strength of Sn15Bi solder but had little effect on elongation. However, Cu addition decreased the tensile strength and elongation of Sn15Bi solder. For solder joints, Ag addition increased the shear strength and toughness of Sn15Bi/Cu joints but Cu addition decreased the shear strength and toughness of Sn15Bi/Cu joints.
Originality/value
The authors can potentially provide a replacement for Sn40Pb traditional solder with Sn15Bi solder by alloying Ag or Cu due to its lower cost and similar melting point as Sn–Pb solder.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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