{"title":"银基填充金属在 SLMed Ti/TiB2 基材上的润湿行为和钎焊接头性能","authors":"Liuyong Wang, Qi Wu, Ziming Song, Yue Li, Xuewen Li, Bing Tu, Yulong Li","doi":"10.1108/ssmt-12-2023-0079","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>This study aims to investigate the wetting behavior of AgCuTi and AgCu filler metals on selective laser melting (SLMed) Ti/TiB<sub>2</sub>, and to analyze the microstructure and fracture characteristics of SLMed Ti/TiB<sub>2</sub>/AgCuTi or AgCu alloy/SLMed Ti/TiB<sub>2</sub> brazed joints. The wetting behavior of AgCuTi and AgCu filler metals on the selective laser melted (SLMed) Ti/TiB<sub>2</sub> has been studied. The analysis of microstructures and fracture characteristics in vacuum-brazed SLMed Ti/TiB<sub>2</sub> substrate, using AgCuTi and AgCu filler metals, has been conducted to elucidate the influence of brazing temperature and alloy composition on the shear strength of the brazed joints.</p><!--/ Abstract__block -->\n<h3>Design/methodology/approach</h3>\n<p>Brazing SLMed-Ti/TiB<sub>2</sub> in a vacuum using AgCuTi and AgCu filler metals, this study aims to explore the optimal parameters for brazed joints at various brazing temperatures (800°C−950°C).</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>The findings suggest that elevated brazing temperatures lead to a more extensive diffusion region in the joint as a result of the partial melting of the filler metal. The joint composition changes from distinct Ti<sub>2</sub>Cu layer/TiCu layer/filler metal to a-Ti (ss) + ß-Ti (ss)/TiCu. As the brazing temperature increases, the fracture mode shifts from brittle cleavage to ductile fracture, mainly attributed to a decrease in the CuTi within the brazed joint. This change in fracture behavior indicates an improvement in the ductility and toughness of the joint.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>The originality of this study lies in the comprehensive analysis of the microstructure and shear strength of vacuum brazing SLMed Ti/TiB<sub>2</sub> using AgCuTi and AgCu filler metals.</p><!--/ Abstract__block -->","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"43 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2024-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Ag-based filler metal wetting behavior and brazed joint performance on SLMed Ti/TiB2 substrate\",\"authors\":\"Liuyong Wang, Qi Wu, Ziming Song, Yue Li, Xuewen Li, Bing Tu, Yulong Li\",\"doi\":\"10.1108/ssmt-12-2023-0079\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3>Purpose</h3>\\n<p>This study aims to investigate the wetting behavior of AgCuTi and AgCu filler metals on selective laser melting (SLMed) Ti/TiB<sub>2</sub>, and to analyze the microstructure and fracture characteristics of SLMed Ti/TiB<sub>2</sub>/AgCuTi or AgCu alloy/SLMed Ti/TiB<sub>2</sub> brazed joints. The wetting behavior of AgCuTi and AgCu filler metals on the selective laser melted (SLMed) Ti/TiB<sub>2</sub> has been studied. The analysis of microstructures and fracture characteristics in vacuum-brazed SLMed Ti/TiB<sub>2</sub> substrate, using AgCuTi and AgCu filler metals, has been conducted to elucidate the influence of brazing temperature and alloy composition on the shear strength of the brazed joints.</p><!--/ Abstract__block -->\\n<h3>Design/methodology/approach</h3>\\n<p>Brazing SLMed-Ti/TiB<sub>2</sub> in a vacuum using AgCuTi and AgCu filler metals, this study aims to explore the optimal parameters for brazed joints at various brazing temperatures (800°C−950°C).</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>The findings suggest that elevated brazing temperatures lead to a more extensive diffusion region in the joint as a result of the partial melting of the filler metal. The joint composition changes from distinct Ti<sub>2</sub>Cu layer/TiCu layer/filler metal to a-Ti (ss) + ß-Ti (ss)/TiCu. As the brazing temperature increases, the fracture mode shifts from brittle cleavage to ductile fracture, mainly attributed to a decrease in the CuTi within the brazed joint. This change in fracture behavior indicates an improvement in the ductility and toughness of the joint.</p><!--/ Abstract__block -->\\n<h3>Originality/value</h3>\\n<p>The originality of this study lies in the comprehensive analysis of the microstructure and shear strength of vacuum brazing SLMed Ti/TiB<sub>2</sub> using AgCuTi and AgCu filler metals.</p><!--/ Abstract__block -->\",\"PeriodicalId\":49499,\"journal\":{\"name\":\"Soldering & Surface Mount Technology\",\"volume\":\"43 1\",\"pages\":\"\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2024-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Soldering & Surface Mount Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1108/ssmt-12-2023-0079\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-12-2023-0079","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Ag-based filler metal wetting behavior and brazed joint performance on SLMed Ti/TiB2 substrate
Purpose
This study aims to investigate the wetting behavior of AgCuTi and AgCu filler metals on selective laser melting (SLMed) Ti/TiB2, and to analyze the microstructure and fracture characteristics of SLMed Ti/TiB2/AgCuTi or AgCu alloy/SLMed Ti/TiB2 brazed joints. The wetting behavior of AgCuTi and AgCu filler metals on the selective laser melted (SLMed) Ti/TiB2 has been studied. The analysis of microstructures and fracture characteristics in vacuum-brazed SLMed Ti/TiB2 substrate, using AgCuTi and AgCu filler metals, has been conducted to elucidate the influence of brazing temperature and alloy composition on the shear strength of the brazed joints.
Design/methodology/approach
Brazing SLMed-Ti/TiB2 in a vacuum using AgCuTi and AgCu filler metals, this study aims to explore the optimal parameters for brazed joints at various brazing temperatures (800°C−950°C).
Findings
The findings suggest that elevated brazing temperatures lead to a more extensive diffusion region in the joint as a result of the partial melting of the filler metal. The joint composition changes from distinct Ti2Cu layer/TiCu layer/filler metal to a-Ti (ss) + ß-Ti (ss)/TiCu. As the brazing temperature increases, the fracture mode shifts from brittle cleavage to ductile fracture, mainly attributed to a decrease in the CuTi within the brazed joint. This change in fracture behavior indicates an improvement in the ductility and toughness of the joint.
Originality/value
The originality of this study lies in the comprehensive analysis of the microstructure and shear strength of vacuum brazing SLMed Ti/TiB2 using AgCuTi and AgCu filler metals.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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