Sn99Ag0.3Cu0.7-TiO2 复合焊点及其对功率元件热参数的影响

IF 1.7 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Soldering & Surface Mount Technology Pub Date : 2024-07-09 DOI:10.1108/ssmt-03-2024-0016
Adrian Pietruszka, Paweł Górecki, Agata Skwarek
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引用次数: 0

摘要

目的 本文旨在研究复合焊点制备方法对金属氧化物半导体场效应晶体管(MOSFET)热性能和焊点机械强度的影响。参考合金为 Sn99Ag0.3Cu0.7。增强焊点的二氧化钛重量百分比从 0.125 到 1.0 Wt.%不等。测试使用了两种元件。0805 封装的电阻器用于机械强度测试,元件焊接在 FR4 基板上。在热参数测量中,使用了 TO-263 封装的功率元件 MOSFET,并将其焊接到金属芯印刷电路板(PCB)基板上。结果剪切测试表明,添加氧化钛不会显著提高焊点的抗机械损伤能力。在批量烘箱中焊接时,与参考样品相比,氧化钛的添加不会对焊点的机械强度产生重大影响。MOSFET 的热阻 Rthj-a 取决于复合焊点中的二氧化钛浓度,当二氧化钛的重量百分比为 0.25 时,热阻 Rthj 达到最小值:TiO2 增强对机械强度的影响微乎其微,这表明液相温度和微观结构发生了变化,需要进一步研究。热性能:热参数随 TiO2 浓度而变化,0.25 Wt.% 时性能最佳。实验验证对实际应用至关重要。实验确认:最佳浓度的验证对于准确评估和实际应用至关重要。焊接方法的影响:批量烘箱焊接可能会影响机械强度,因此有必要探索其他方法。热性能与机械性能的增强:虽然二氧化钛并不能显著增强机械强度,但却能改善热性能,这突出说明了在功率半导体组装中进行平衡设计的必要性。必须通过实验确定平衡热性能和机械强度的最佳浓度。批量烘箱焊接可能会影响机械强度,因此需要评估替代技术。二氧化钛复合焊点有望在功率电子器件中实现高效散热。微结构分析可优化焊点设计和性能。焊接过程中严格的质量控制可确保稳定的热性能,并减轻对机械强度的负面影响。然而,它对机械强度的影响有限,可能会影响产品的可靠性。要了解这些影响,就需要研究人员和行业利益相关者通力合作,共同开发稳健的焊接技术。通过实验验证确保最佳的 TiO2 浓度对于保持产品完整性和安全标准至关重要。此外,传播研究成果和最佳实践可以使制造商做出明智的决策,促进电子制造工艺的创新和可持续发展。最终,解决这些社会问题将促进技术进步,同时优先考虑消费者的信任和电子行业的产品质量。原创性/价值该研究表明了用于组装 MOSFET 器件的焊接技术的重要性。
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Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components

Purpose

This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint.

Design/methodology/approach

Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven.

Findings

Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance Rthj-a of MOSFETs depends on TiO2 concentration in the composite solder joint reaching the minimum Rthj at 0.25 Wt.% of TiO2.

Research limitations/implications

Mechanical strength: TiO2 reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO2 concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO2 does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly.

Practical implications

Incorporating TiO2 enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO2 composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous quality control during soldering ensures consistent thermal performance and mitigates negative effects on mechanical strength.

Social implications

The integration of TiO2 reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative efforts between researchers and industry stakeholders to develop robust soldering techniques. Ensuring optimal TiO2 concentration through experimental validation is essential to maintain product integrity and safety standards. Additionally, dissemination of research findings and best practices can empower manufacturers to make informed decisions, fostering innovation and sustainability in electronic manufacturing processes. Ultimately, addressing these social implications promotes technological advancement while prioritizing consumer trust and product quality in the electronics industry.

Originality/value

The research shows the importance of the soldering technology used to assemble MOSFET devices.

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来源期刊
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 工程技术-材料科学:综合
CiteScore
4.10
自引率
15.00%
发文量
30
审稿时长
>12 weeks
期刊介绍: Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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