Shaobin Wang, Peng Liu, Sen Cong, Weiqi Guo, Weiwei Zhang
{"title":"机电耦合负载下 Sn37Pb 焊点中微实体的演变","authors":"Shaobin Wang, Peng Liu, Sen Cong, Weiqi Guo, Weiwei Zhang","doi":"10.1007/s11664-024-11313-4","DOIUrl":null,"url":null,"abstract":"<p>In this study, a Sn37Pb solder joint was subjected to mechanical loading (constant 5 N force applied in the vertical direction) for a duration of 400 h in order to investigate the evolution of micro-voids. Under electromechanical loading, micro-voids exhibited growth and subsequent shrinkage. Solder joint resistance initially increased and then decreased. The decrease in void volume and the reduction in solder joint resistance are both attributed to the creep deformation occurring in the vertical direction of the solder joint. Notably, no significant element migration was observed within the solder joints after 400 h of loading. The significant stress gradients within the solder joints result in increased back stress, thus balancing the electromigration stress and completely suppressing element migration.</p>","PeriodicalId":626,"journal":{"name":"Journal of Electronic Materials","volume":"22 1","pages":""},"PeriodicalIF":2.2000,"publicationDate":"2024-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Evolution of Micro-Voids in Sn37Pb Solder Joints Under Electromechanical Coupling Loading\",\"authors\":\"Shaobin Wang, Peng Liu, Sen Cong, Weiqi Guo, Weiwei Zhang\",\"doi\":\"10.1007/s11664-024-11313-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>In this study, a Sn37Pb solder joint was subjected to mechanical loading (constant 5 N force applied in the vertical direction) for a duration of 400 h in order to investigate the evolution of micro-voids. Under electromechanical loading, micro-voids exhibited growth and subsequent shrinkage. Solder joint resistance initially increased and then decreased. The decrease in void volume and the reduction in solder joint resistance are both attributed to the creep deformation occurring in the vertical direction of the solder joint. Notably, no significant element migration was observed within the solder joints after 400 h of loading. The significant stress gradients within the solder joints result in increased back stress, thus balancing the electromigration stress and completely suppressing element migration.</p>\",\"PeriodicalId\":626,\"journal\":{\"name\":\"Journal of Electronic Materials\",\"volume\":\"22 1\",\"pages\":\"\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2024-08-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Materials\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1007/s11664-024-11313-4\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1007/s11664-024-11313-4","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
The Evolution of Micro-Voids in Sn37Pb Solder Joints Under Electromechanical Coupling Loading
In this study, a Sn37Pb solder joint was subjected to mechanical loading (constant 5 N force applied in the vertical direction) for a duration of 400 h in order to investigate the evolution of micro-voids. Under electromechanical loading, micro-voids exhibited growth and subsequent shrinkage. Solder joint resistance initially increased and then decreased. The decrease in void volume and the reduction in solder joint resistance are both attributed to the creep deformation occurring in the vertical direction of the solder joint. Notably, no significant element migration was observed within the solder joints after 400 h of loading. The significant stress gradients within the solder joints result in increased back stress, thus balancing the electromigration stress and completely suppressing element migration.
期刊介绍：
The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.
A journal of The Minerals, Metals & Materials Society.
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