Jinshuai Xie, Lei Tang, Pengfei Gao, Zhengquan Zhang, Liangfeng Li
{"title":"添加镍对 Sn-0.7Cu-xNi 焊料合金润湿性和界面微观结构的影响","authors":"Jinshuai Xie, Lei Tang, Pengfei Gao, Zhengquan Zhang, Liangfeng Li","doi":"10.1108/ssmt-08-2023-0053","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>This paper aims to study the effect of different Ni content on the microstructure and properties of Sn-0.7Cu alloy. Then, the spreading area, wetting angle, interface layer thickness and microstructure of the soldering interface was observed and analyzed at different soldering temperatures and times.</p><!--/ Abstract__block -->\n<h3>Design/methodology/approach</h3>\n<p>Sn-0.7Cu-xNi solder alloy was prepared by a high-frequency induction melting furnace. Then Sn-0.7Cu-xNi alloy was soldered on a Cu substrate at different soldering temperatures and times.</p><!--/ Abstract__block -->\n<h3>Findings</h3>\n<p>It was found that Ni made the intermetallic compounds in the Sn-0.7Cu solder alloy gradually aggregate and coarsen, and the microstructure was refined. The phase compositions of the solder alloy are mainly composed of the ß-Sn phase and a few intermetallic compounds, Cu<sub>6</sub>Sn<sub>5</sub> + (Cu, Ni)<sub>6</sub>Sn<sub>5</sub>. The maximum value of 12.1 HV is reached when the Ni content is 0.1 Wt.%. When the Ni content is 0.5 Wt.%, the wettability of the solder alloy increases by about 15%, the interface thickness increases by about 8.9% and the scallop-like structure is the most refined. When the soldering time is 10 min and the soldering temperature is 280 °C, the wettability of Sn-0.7Cu-0.2Ni is the best.</p><!--/ Abstract__block -->\n<h3>Originality/value</h3>\n<p>It is groundbreaking to combine the change in soldering interface with the soldering industry. The effects of different soldering temperatures and times on the Sn-0.7Cu-xNi alloy were studied. Under the same conditions, Sn-0.7Cu-0.2Ni exhibits better wettability and more stable solder joint stability.</p><!--/ Abstract__block -->","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"26 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy\",\"authors\":\"Jinshuai Xie, Lei Tang, Pengfei Gao, Zhengquan Zhang, Liangfeng Li\",\"doi\":\"10.1108/ssmt-08-2023-0053\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3>Purpose</h3>\\n<p>This paper aims to study the effect of different Ni content on the microstructure and properties of Sn-0.7Cu alloy. Then, the spreading area, wetting angle, interface layer thickness and microstructure of the soldering interface was observed and analyzed at different soldering temperatures and times.</p><!--/ Abstract__block -->\\n<h3>Design/methodology/approach</h3>\\n<p>Sn-0.7Cu-xNi solder alloy was prepared by a high-frequency induction melting furnace. Then Sn-0.7Cu-xNi alloy was soldered on a Cu substrate at different soldering temperatures and times.</p><!--/ Abstract__block -->\\n<h3>Findings</h3>\\n<p>It was found that Ni made the intermetallic compounds in the Sn-0.7Cu solder alloy gradually aggregate and coarsen, and the microstructure was refined. The phase compositions of the solder alloy are mainly composed of the ß-Sn phase and a few intermetallic compounds, Cu<sub>6</sub>Sn<sub>5</sub> + (Cu, Ni)<sub>6</sub>Sn<sub>5</sub>. The maximum value of 12.1 HV is reached when the Ni content is 0.1 Wt.%. 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Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy
Purpose
This paper aims to study the effect of different Ni content on the microstructure and properties of Sn-0.7Cu alloy. Then, the spreading area, wetting angle, interface layer thickness and microstructure of the soldering interface was observed and analyzed at different soldering temperatures and times.
Design/methodology/approach
Sn-0.7Cu-xNi solder alloy was prepared by a high-frequency induction melting furnace. Then Sn-0.7Cu-xNi alloy was soldered on a Cu substrate at different soldering temperatures and times.
Findings
It was found that Ni made the intermetallic compounds in the Sn-0.7Cu solder alloy gradually aggregate and coarsen, and the microstructure was refined. The phase compositions of the solder alloy are mainly composed of the ß-Sn phase and a few intermetallic compounds, Cu6Sn5 + (Cu, Ni)6Sn5. The maximum value of 12.1 HV is reached when the Ni content is 0.1 Wt.%. When the Ni content is 0.5 Wt.%, the wettability of the solder alloy increases by about 15%, the interface thickness increases by about 8.9% and the scallop-like structure is the most refined. When the soldering time is 10 min and the soldering temperature is 280 °C, the wettability of Sn-0.7Cu-0.2Ni is the best.
Originality/value
It is groundbreaking to combine the change in soldering interface with the soldering industry. The effects of different soldering temperatures and times on the Sn-0.7Cu-xNi alloy were studied. Under the same conditions, Sn-0.7Cu-0.2Ni exhibits better wettability and more stable solder joint stability.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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