大面积脉冲激光沉积用于神经形态计算的记忆性 Pr0.7Ca0.3MnO3 异质结构

IF 2 4区 材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS Thin Solid Films Pub Date : 2024-08-19 DOI:10.1016/j.tsf.2024.140499
M. Buczek , M. Pohlmann , Z. Liu , Z. Moos , A. Gutsche , P. Cao , J. Mayer , W. Stein , R. Dittmann
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引用次数: 0

摘要

过氧化物 Pr0.7Ca0.3MnO3(PCMO)和 AlOx 等隧道氧化物的异质结构是非常有趣的记忆性器件,可用于模拟神经形态电路中的突触特性。未来采用这些记忆元件的芯片需要 PLD 系统,以便在完整晶片上生长 PCMO。为了解决本研究中的羽流扩展问题,使用了狭缝系统来定位沉积区域,从而消除了过度扫描的需要。本研究调查了狭缝系统和制程气体压力对羽流扩展的影响。这项研究被用于模拟软件的参数设置,以评估不同运动速度的效果,并开发出可调整到所选薄膜厚度(20 纳米左右)的均匀沉积策略。我们利用这些策略,在标准 4 英寸硅晶片上使用 Pr0.7Ca0.3MnO3 和 AlOx 的材料组合制造了面积相关的开关存储单元。氧化铝厚度对开关的影响表明,氧化铝厚度≥ 3 nm 时,IV 环路开始出现滞后现象。氧化铝厚度增加会导致电阻和电容充电增加。额外的热处理可降低电阻和开关电压,并增加低电阻和高电阻状态之间的比率。未对 PCMO 进行热处理的器件可用于标准 CMOS 技术的后端处理。
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Large area pulsed laser deposition of memristive Pr0.7Ca0.3MnO3 heterostructures for neuromorphic computing

Heterostructures of the perovskite Pr0.7Ca0.3MnO3 (PCMO) and a tunnel oxide such as AlOx are highly interesting memristive devices for emulating synaptic properties in neuromorphic circuits. Future chip generations with these memristive elements requires PLD systems which enables PCMO growth on a full wafer. To address the issue of plume broadening in this study, a slit system was used to localize the deposition region, thereby eliminating the need for excessive scanning. This study investigates the effect of the slit system and process gas pressure on plume broadening. This investigation has been used to parameterize a simulation software to assess the effectiveness of different movement speeds and to develop strategies for homogeneous deposition, adjustable to a chosen film thickness in the order of twenty nanometers. We used these strategies to fabricate area dependent switching memory cells on a standard 4″ Si wafer using the material combination of Pr0.7Ca0.3MnO3 and AlOx. The influence of the aluminum oxide thickness on the switching shows that the IV loop starts to exhibit a hysteresis for AlOx thicknesses ≥ 3 nm. An increase in AlOx thickness leads to an increase in resistance and capacitive charging. An additional thermal treatment reduces the resistance and the switching voltage and increases the ratio between low resistive and high resistive state. Devices without thermal treatment of the PCMO are compatible for back end of line processing of standard CMOS technology.

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来源期刊
Thin Solid Films
Thin Solid Films 工程技术-材料科学:膜
CiteScore
4.00
自引率
4.80%
发文量
381
审稿时长
7.5 months
期刊介绍: Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.
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