Enhancing thermal conductivity of AlN ceramics via vat photopolymerization through refractive index coupling and oxygen fixation

Despite the growing development of ceramic fabrication by vat photopolymerization (VP), major gaps remain in application. Particularly in the case of VP-printed aluminum nitride (AlN) ceramic, the thermal conductivity is still below 170 W·m⁻¹·K⁻¹, a critical benchmark for efficient heat dissipation. To address this challenge, here we prepared an AlN slurry with high curing thickness through RI coupling between liquid-solid phase, and took into account of the rheological property under high solid loading. Full dense AlN green bodies with solid loading up to 50 vol% were successfully printed. Aiming to to tackle the degradation of thermal conductivity issue caused by oxygen increment of AlN via VP, we systemically studied the form of oxygen in AlN preparation processes. Through the sintering optimization, the oxygen element from the hydrolysis of AlN surface was fixated in the sintering aid Y₂O₃. Eventually, without any special process control or additional treatment, the final sintered AlN ceramics prepared by the developed slurry present a full densification and the highest thermal conductivity (up to 187.9 W∙m⁻¹∙K⁻¹) of any known additive manufactured ceramics.