Linhan Jing, Fa Luo, Haijun Pan, Liuchao Zhang, Lechun Deng, Yulong Xue, Xinyi Wang
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引用次数: 0
摘要
最近,碳化硅连续纤维增强陶瓷基复合材料被广泛用于高温吸波材料。然而,过高的碳含量会导致吸波性能下降。为了解决 SiC 基体的阻抗失配问题并增加多相界面的电荷积累,本文采用溶胶-凝胶法制备了 SiCf/莫来石复合材料。不含游离碳的莫来石基体的引入改善了阻抗匹配特性。原位生长的二氧化硅层与莫来石基体之间因高温而产生的强粘结作用诱发了麦克斯韦-瓦格纳效应,从而有效优化了吸波性能。复合材料的复介电常数随着烧结温度的升高而增大。烧结温度为 1100 ℃ 时,最高反射损耗达到 - 23.1 dB。在两步干燥过程中,孔隙率降低到 16.1%,密度增加。莫来石基体的结晶度和密度随着烧结温度的升高而增加,在 1100 °C 下烧结的复合材料的弯曲强度最高,达到 157.89 兆帕。
The dielectric adjustment in SiCf/mullite composites limited carbon content by in situ growth SiO2 layer
Recently, SiC-continued fiber-reinforced ceramic matrix composites were widely used in high-temperature absorbing materials. However, the excessive carbon content indicated the deteriorative absorbing property. To solve the impedance mismatching of the SiC matrix and increase the charge accumulation at the multi-phase interface, SiCf/mullite composites were prepared in this paper by using the sol–gel method. The introduction of mullite matrix without free carbon improved impedance matching characteristics. The strong bonding between the in situ grown SiO2 layer and the mullite matrix caused by high temperature induced the Maxwell–Wagner effect, which effectively optimized the absorbing performance. The complex dielectric constant of the composite increased with higher sintering temperatures. The highest reflection loss reached − 23.1 dB at the sintering temperature of 1100 °C. With the two-step drying process, the porosity was reduced to 16.1% and the density increased. The crystallinity and density of the mullite matrix increased in the rising sintering temperatures, with the highest bending strength reaching 157.89 MPa for composites sintered at 1100 °C.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.