通过双峰粒度分布优化六方氮化硼陶瓷的结构各向异性和热性能

IF 5.1 2区 材料科学 Q1 MATERIALS SCIENCE, CERAMICS Ceramics International Pub Date : 2024-09-24 DOI:10.1016/j.ceramint.2024.09.320
Yanli Ye , Zijun He , Zheng Qi , Wenkang Ye , Junlin Xie
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引用次数: 0

摘要

六方氮化硼(h-BN)陶瓷具有优异的热导率,但将其各向异性的热性能整合到大块陶瓷中仍具有挑战性。本研究探讨了双峰粒度分布对 h-BN 陶瓷结构、热性能和机械性能的影响。通过 DEM 模拟和热压技术,我们证明了在细颗粒中加入大颗粒可显著提高 h-BN 陶瓷的堆积密度、结构各向异性和热性能。用 10 Vol% 的大颗粒(10LBN)制备的高纯度 h-BN 陶瓷的取向偏好指数(IOP)为 -2780.57,超过了无大颗粒陶瓷(0LBN)的 -1168.61。通过调节结构,10LBN h-BN 陶瓷的面内导热系数从 0LBN 陶瓷的 81.78 显著提高到 153.20 W/(m-K),抗弯强度也达到 58.21 MPa。此外,结构表征和性能测试表明,与添加烧结添加剂相比,加入大的板状 h-BN 颗粒在优化 h-BN 陶瓷的取向结构和热导率方面具有更大的优势。这些发现为使用双尺寸板状颗粒进行粉末压制以及烧结具有定制结构和热性能的 h-BN 陶瓷提供了新的见解。
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Optimizing structural anisotropy and thermal properties of hexagonal boron nitride ceramics through bimodal particle size distribution
Hexagonal boron nitride (h-BN) ceramics exhibit exceptional thermal conductivity, yet integrating their anisotropic thermal properties into bulk ceramics remains challenging. This study investigates the impact of bimodal particle size distribution on the structure, thermal and mechanical properties of h-BN ceramics. Through DEM simulations and hot-pressing techniques, we demonstrate that incorporating large particles into fine ones significantly enhances the packing density, structural anisotropy and thermal properties of h-BN ceramics. The resulting high-purity h-BN ceramic prepared with 10 vol% large particles (10LBN) exhibits an Index of Orientation Preference (IOP) of −2780.57, surpassing that of ceramics without large particles (0LBN) at −1168.61. By regulating the structure, 10LBN h-BN ceramic show a notable increase of the in-plane thermal conductivity from 81.78 for 0LBN ceramics to 153.20 W/(m·K), along with a flexural strength of 58.21 MPa. Additionally, structural characterization and performance testing show that, compared to adding sintering additives, incorporating large plate-like h-BN particles offers greater benefits in optimizing the orientation structure and thermal conductivity of h-BN ceramics. These findings offer new insights for powder compaction using dual-sized plate-like particles and into the sintering of h-BN ceramics with tailored structural and thermal properties.
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来源期刊
Ceramics International
Ceramics International 工程技术-材料科学:硅酸盐
CiteScore
9.40
自引率
15.40%
发文量
4558
审稿时长
25 days
期刊介绍: Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.
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