钙钨青铜光学特性的密度泛函理论与实验研究

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2024-11-21 DOI:10.1007/s10854-024-13883-9
Rishun Na, Yongbo Ma, Luomeng Chao
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引用次数: 0

摘要

利用固态反应法成功合成了碱土金属钨青铜 Ca0.1WO3。XRD、SEM 和 TEM 分析证实了该材料具有良好的结晶性,但也观察到了严重的颗粒聚集现象。光学特性测试表明,Ca0.1WO3 在可见光区域的吸收和反射率较低,而在近红外区域的吸收和反射率较高。XPS 测量和 DFT 理论计算表明,钙离子的引入使 WO3 从半导体状态转变为金属状态,六价 W 部分还原为五价 W,从而为材料引入了额外的自由电子,导致入射光下的局部表面等离子体共振(LSPR)效应,大大提高了其近红外吸收性能。碱土金属钨青铜的这些特性使其成为透明隔热材料的潜在候选材料。
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Density functional theory and experimental study on the optical properties of calcium tungsten bronze

The alkaline earth metal tungsten bronze Ca0.1WO3 was successfully synthesized using the solid-state reaction method. XRD, SEM, and TEM analyses confirmed the good crystallinity of the material, although severe particle aggregation was observed. Optical property tests revealed low absorption and reflection in the visible light region, and higher values in the near-infrared region for Ca0.1WO3. XPS measurements and DFT theoretical calculations suggested that the introduction of Ca ions transformed WO3 from a semiconductor to a metallic state, with partial reduction of hexavalent W to pentavalent W. This introduced additional free electrons to the material, resulting in localized surface plasmon resonance (LSPR) effects under incident light, significantly enhancing its near-infrared absorption performance. These characteristics of alkaline earth metal tungsten bronze make it a potential candidate for transparent thermal insulation materials.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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