Microstructure and Raman spectra analysis of [(Zn0.8Mg0.2)1-xNix]2SiO4 microwave dielectric ceramics featuring low relative permittivity and low dielectric loss

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-03-05 DOI:10.1007/s10854-025-14468-w
Yuan-Bin Chen, Ling Tang
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Abstract

A solid-state reaction method was successfully employed to synthesize [(Zn0.8Mg0.2)1-xNix]2SiO4 microwave dielectric ceramics by partially substituting [Zn0.8Mg0.2]2+ with Ni2+ ions. XRD analysis indicated that the proportion of the primary Zn2SiO4 phase decreases with increasing Ni2+ content, while the secondary MgNi(SiO4) phase becomes predominant. This phase transition contributes to a reduction in dielectric loss. The sintering behavior, phase composition, microstructure, and microwave dielectric properties of the ceramics were systematically investigated. The incorporation of Ni2+ ions lowered the optimal sintering temperature from 1325 to 1400 °C. SEM analysis revealed that an optimal Ni2+ substitution level enhanced the grain density within the [(Zn0.8Mg0.2)1-xNix]2SiO4 ceramic matrix. The relationship between Q × f and the average grain size as well as grain uniformity was analyzed. The trend of τf is primarily governed by the total Vizn-o and Ezn-o. Additionally, the relationship between lattice vibrations, Raman shifts, and dielectric properties was investigated using Raman spectroscopy. Certainly, the [(Zn0.8Mg0.2)0.8Ni0.2]2SiO4 ceramic, sintered at 1325 °C, exhibits an exemplary set of microwave dielectric properties: an εr value of 6.8, a Q × f value of 27,185 GHz, and a τf value of − 37 ppm/ °C.

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具有低相对介电系数和低介电损耗特性的[(Zn0.8Mg0.2)1-xNix]2SiO4 微波介电陶瓷的显微结构和拉曼光谱分析
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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