用于低功耗数字应用的芯壳双金属栅极堆叠无结累加模式纳米线场效应晶体管(CS-DM-GS-JAMNWFET)的数值模拟

IF 2.7 Q2 PHYSICS, CONDENSED MATTER Micro and Nanostructures Pub Date : 2024-10-24 DOI:10.1016/j.micrna.2024.207995
Anupama , Sonam Rewari , Neeta Pandey
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引用次数: 0

摘要

本文提出的芯壳双金属栅极堆叠无结累积模式纳米线场效应晶体管(CS-DM-GS-JAMNWFET)性能更强,适用于模拟和数字应用。在芯壳结构的外部和内部栅极氧化物中采用了高 K 值栅极叠层工程--氧化铪(HfO2)。通过保持所有结构的阈值电压恒定,将所提出的器件与 CS-DM-JAMNWFET、CS-SM-JAMNWFET、DM-GS-JAMNWFET、DM-JAMNWFET 和 SM-JAMNWFET 进行了比较。与其他合格的器件结构相比,拟议的 CS-DM-GS-JAMNWFET 以高离子/关断比大幅降低了亚阈值电流。此外,与 SM-JAMNWFET 相比,所提出的器件在各种参数上都有所改进。它在漏极电流(2.27 倍)、输出电导(2.14 倍)、阈下摆动(0.94 倍)、跨电导(2.47 倍)、栅极电容(2.00 倍)、截止频率(1.24 倍)、本征增益(12.95 倍)、电流增益(1.46 倍)、离子/关断比(6.15 倍)、单边功率增益(1.09 倍)、最大换能器功率增益(1.08 倍)、跨导生成系数(1.08 倍)、增益频率乘积(14.61 倍)、跨导频率乘积(1.32 倍)和增益跨导频率乘积(17.27 倍)。这些优势归功于芯壳 JAM FET 中双金属高介电 HfO2 结构的综合优势,它增强了器件在高驱动电流下栅极对沟道的主导地位。
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Numerical simulation of core shell dual metal gate stack junctionless accumulation mode nanowire FET (CS-DM-GS-JAMNWFET) for low power digital applications
In this paper, Core Shell Dual Metal Gate Stack Junctionless Accumulation Mode Nanowire FET (CS-DM-GS-JAMNWFET) is proposed, which has enhanced performance and is suitable for analog and digital applications. A high-k gate stack engineering, Hafnium Oxide (HfO2) is deployed in the outer as well as inner gate oxides of the core shell structure. The proposed device is compared with CS-DM-JAMNWFET, CS-SM-JAMNWFET, DM-GS-JAMNWFET, DM-JAMNWFET, and SM-JAMNWFET by maintaining a constant threshold voltage for all structures. The proposed CS-DM-GS-JAMNWFET provides a substantial reduction in subthreshold current with a high Ion/Ioff ratio as compared to other competent device structures. Also, the proposed device exhibits improvements in various parameters compared to the SM-JAMNWFET. It shows improvement in drain current (2.27 times), output conductance (2.14 times), subthreshold swing (0.94 times), transconductance (2.47 times), gate capacitance (2.00 times), cut-off frequency (1.24 times), intrinsic gain (12.95 times), current gain (1.46), Ion/Ioff ratio (6.15 times), unilateral power gain (1.09 times), maximum transducer power gain (1.08 times), Transconductance Generation factor (1.08 times), gain frequency product (14.61 times), transconductance frequency product (1.32 times), and gain transconductance frequency product (17.27 times). These benefits are due to combined advantages of the dual metal high-k dielectric HfO2 structure in core shell JAM FET, which enhances the device's gate dominance over the channel with high driving current.
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