Ming Chen, Zhi Ding, Weidong Wang, Baoyin Hou, Lufeng Che
{"title":"基于应力诱发规则线性裂纹的倒金字塔微结构阵列高灵敏度柔性应变传感器","authors":"Ming Chen, Zhi Ding, Weidong Wang, Baoyin Hou, Lufeng Che","doi":"10.1007/s11664-024-11474-2","DOIUrl":null,"url":null,"abstract":"<div><p>Crack-based flexible strain sensors inspired by a spider’s slit organs have exhibited high sensitivity. However, the sensitivity of crack-based sensors can be negatively affected by cracks with random and undirected features. In this work, we fabricated a high-sensitivity flexible strain sensor with regular linear microcracks induced by stress concentration. The sensor consists of a polydimethylsiloxane (PDMS) flexible substrate with an inverted pyramid array and a conductive metal layer of Ti/Au film that was sputtered on the substrate surface. When the sensor was stretched, stress concentrations will occur near the inverted pyramids, inducing the generation of linear microcracks perpendicular to the stretching directions between the adjacent inverted pyramids. The testing results demonstrated that the sensor has a high sensitivity (a gauge factor of 9327 in the strain range of 7.6–10%), a wide working range (0–10% strain), and a fast response/recovery time (77/82 ms). These features enable the sensor to have potential applications in health monitoring and human–computer interaction, such as finger motion recognition and neck bending direction detection.</p></div>","PeriodicalId":626,"journal":{"name":"Journal of Electronic Materials","volume":"54 1","pages":"241 - 250"},"PeriodicalIF":2.2000,"publicationDate":"2024-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://link.springer.com/content/pdf/10.1007/s11664-024-11474-2.pdf","citationCount":"0","resultStr":"{\"title\":\"High-Sensitivity Flexible Strain Sensor with the Inverted Pyramid Microstructure Array Based on Stress-Induced Regular Linear Cracks\",\"authors\":\"Ming Chen, Zhi Ding, Weidong Wang, Baoyin Hou, Lufeng Che\",\"doi\":\"10.1007/s11664-024-11474-2\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Crack-based flexible strain sensors inspired by a spider’s slit organs have exhibited high sensitivity. However, the sensitivity of crack-based sensors can be negatively affected by cracks with random and undirected features. In this work, we fabricated a high-sensitivity flexible strain sensor with regular linear microcracks induced by stress concentration. The sensor consists of a polydimethylsiloxane (PDMS) flexible substrate with an inverted pyramid array and a conductive metal layer of Ti/Au film that was sputtered on the substrate surface. When the sensor was stretched, stress concentrations will occur near the inverted pyramids, inducing the generation of linear microcracks perpendicular to the stretching directions between the adjacent inverted pyramids. The testing results demonstrated that the sensor has a high sensitivity (a gauge factor of 9327 in the strain range of 7.6–10%), a wide working range (0–10% strain), and a fast response/recovery time (77/82 ms). These features enable the sensor to have potential applications in health monitoring and human–computer interaction, such as finger motion recognition and neck bending direction detection.</p></div>\",\"PeriodicalId\":626,\"journal\":{\"name\":\"Journal of Electronic Materials\",\"volume\":\"54 1\",\"pages\":\"241 - 250\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2024-09-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://link.springer.com/content/pdf/10.1007/s11664-024-11474-2.pdf\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Electronic Materials\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s11664-024-11474-2\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Electronic Materials","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s11664-024-11474-2","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
High-Sensitivity Flexible Strain Sensor with the Inverted Pyramid Microstructure Array Based on Stress-Induced Regular Linear Cracks
Crack-based flexible strain sensors inspired by a spider’s slit organs have exhibited high sensitivity. However, the sensitivity of crack-based sensors can be negatively affected by cracks with random and undirected features. In this work, we fabricated a high-sensitivity flexible strain sensor with regular linear microcracks induced by stress concentration. The sensor consists of a polydimethylsiloxane (PDMS) flexible substrate with an inverted pyramid array and a conductive metal layer of Ti/Au film that was sputtered on the substrate surface. When the sensor was stretched, stress concentrations will occur near the inverted pyramids, inducing the generation of linear microcracks perpendicular to the stretching directions between the adjacent inverted pyramids. The testing results demonstrated that the sensor has a high sensitivity (a gauge factor of 9327 in the strain range of 7.6–10%), a wide working range (0–10% strain), and a fast response/recovery time (77/82 ms). These features enable the sensor to have potential applications in health monitoring and human–computer interaction, such as finger motion recognition and neck bending direction detection.
期刊介绍:
The Journal of Electronic Materials (JEM) reports monthly on the science and technology of electronic materials, while examining new applications for semiconductors, magnetic alloys, dielectrics, nanoscale materials, and photonic materials. The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials. Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
Review papers on current topics enable individuals in the field of electronics to keep abreast of activities in areas peripheral to their own. JEM also selects papers from conferences such as the Electronic Materials Conference, the U.S. Workshop on the Physics and Chemistry of II-VI Materials, and the International Conference on Thermoelectrics. It benefits both specialists and non-specialists in the electronic materials field.
A journal of The Minerals, Metals & Materials Society.