基于TSV的三维变压器磁耦合系数精确建模

IF 2.9 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Microwave and Wireless Components Letters Pub Date : 2022-12-01 DOI:10.1109/LMWC.2022.3195193

Haidong Wu, Gang Dong, Wei Xiong, Chang Zhi, Shen Li, Zhangming Zhu, Yintang Yang

{"title":"基于TSV的三维变压器磁耦合系数精确建模","authors":"Haidong Wu, Gang Dong, Wei Xiong, Chang Zhi, Shen Li, Zhangming Zhu, Yintang Yang","doi":"10.1109/LMWC.2022.3195193","DOIUrl":null,"url":null,"abstract":"This letter presents an accurate magnetic coupling coefficient (<inline-formula> <tex-math notation=\"LaTeX\">$k$ </tex-math></inline-formula>) model for a through-silicon via (TSV)-based 3-D transformer. The <inline-formula> <tex-math notation=\"LaTeX\">$k$ </tex-math></inline-formula> factor can be precisely derived from the self-inductance and mutual inductance, which are calculated by various analytical formulas based on physical geometries. The results of this model correspond well with those of Q3D extractor and high-frequency structural simulator (HFSS), with maximum errors of 3.8% and 4.4%, respectively. An equivalent circuit model of a TSV-based transformer is used for further verification. The S-parameters obtained by the circuit model match well with the measurements.","PeriodicalId":13130,"journal":{"name":"IEEE Microwave and Wireless Components Letters","volume":"32 1","pages":"1419-1422"},"PeriodicalIF":2.9000,"publicationDate":"2022-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Accurate Magnetic Coupling Coefficient Modeling of 3-D Transformer Based on TSV\",\"authors\":\"Haidong Wu, Gang Dong, Wei Xiong, Chang Zhi, Shen Li, Zhangming Zhu, Yintang Yang\",\"doi\":\"10.1109/LMWC.2022.3195193\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This letter presents an accurate magnetic coupling coefficient (<inline-formula> <tex-math notation=\\\"LaTeX\\\">$k$ </tex-math></inline-formula>) model for a through-silicon via (TSV)-based 3-D transformer. The <inline-formula> <tex-math notation=\\\"LaTeX\\\">$k$ </tex-math></inline-formula> factor can be precisely derived from the self-inductance and mutual inductance, which are calculated by various analytical formulas based on physical geometries. The results of this model correspond well with those of Q3D extractor and high-frequency structural simulator (HFSS), with maximum errors of 3.8% and 4.4%, respectively. An equivalent circuit model of a TSV-based transformer is used for further verification. The S-parameters obtained by the circuit model match well with the measurements.\",\"PeriodicalId\":13130,\"journal\":{\"name\":\"IEEE Microwave and Wireless Components Letters\",\"volume\":\"32 1\",\"pages\":\"1419-1422\"},\"PeriodicalIF\":2.9000,\"publicationDate\":\"2022-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Microwave and Wireless Components Letters\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://doi.org/10.1109/LMWC.2022.3195193\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Microwave and Wireless Components Letters","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/LMWC.2022.3195193","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 2

摘要

这封信提出了一个基于硅通孔（TSV）的三维变压器的精确磁耦合系数（$k$）模型。$k$因子可以从自感和互感中精确推导出来，自感和互感是根据物理几何形状通过各种分析公式计算出来的。该模型的结果与Q3D提取器和高频结构模拟器的结果一致，最大误差分别为3.8%和4.4%。使用基于TSV的变压器的等效电路模型进行进一步验证。通过电路模型获得的S参数与测量结果吻合良好。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Accurate Magnetic Coupling Coefficient Modeling of 3-D Transformer Based on TSV

This letter presents an accurate magnetic coupling coefficient (

$k$

) model for a through-silicon via (TSV)-based 3-D transformer. The

$k$

factor can be precisely derived from the self-inductance and mutual inductance, which are calculated by various analytical formulas based on physical geometries. The results of this model correspond well with those of Q3D extractor and high-frequency structural simulator (HFSS), with maximum errors of 3.8% and 4.4%, respectively. An equivalent circuit model of a TSV-based transformer is used for further verification. The S-parameters obtained by the circuit model match well with the measurements.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IEEE Microwave and Wireless Components Letters 工程技术-工程：电子与电气

自引率

13.30%

发文量

376

审稿时长

3.0 months

期刊介绍： The IEEE Microwave and Wireless Components Letters (MWCL) publishes four-page papers (3 pages of text + up to 1 page of references) that focus on microwave theory, techniques and applications as they relate to components, devices, circuits, biological effects, and systems involving the generation, modulation, demodulation, control, transmission, and detection of microwave signals. This includes scientific, technical, medical and industrial activities. Microwave theory and techniques relates to electromagnetic waves in the frequency range of a few MHz and a THz; other spectral regions and wave types are included within the scope of the MWCL whenever basic microwave theory and techniques can yield useful results. Generally, this occurs in the theory of wave propagation in structures with dimensions comparable to a wavelength, and in the related techniques for analysis and design.