{"title":"利用自动光学检测数据研究摘放机缺陷模式","authors":"Yuqiao Cen, Jingxi He, Daehan Won","doi":"10.1108/ssmt-03-2021-0007","DOIUrl":null,"url":null,"abstract":"\nPurpose\nThis paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause identification model using machine learning.\n\n\nDesign/methodology/approach\nThis study conducts experiments to simulate the P&P machine errors including nozzle size and nozzle pick-up position. The component placement qualities with different errors are inspected. This study uses various machine learning methods to develop a root cause identification model based on the inspection result.\n\n\nFindings\nThe experimental results revealed that the wrong nozzle size could increase the mean and the standard deviation of component placement offset and the probability of component drop during the transfer process. Moreover, nozzle pick-up position can affect the rotated component placement offset. These root causes of defects can be traced back using machine learning methods.\n\n\nPractical implications\nThis study provides operators in surface mount technology assembly lines to understand the P&P machine error symptoms. The developed model can trace back the root causes of defects automatically in real line production.\n\n\nOriginality/value\nThe findings are expected to lead the regular preventive maintenance to data-driven predictive and reactive maintenance.\n","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2021-08-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Defect patterns study of pick-and-place machine using automated optical inspection data\",\"authors\":\"Yuqiao Cen, Jingxi He, Daehan Won\",\"doi\":\"10.1108/ssmt-03-2021-0007\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\nPurpose\\nThis paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause identification model using machine learning.\\n\\n\\nDesign/methodology/approach\\nThis study conducts experiments to simulate the P&P machine errors including nozzle size and nozzle pick-up position. The component placement qualities with different errors are inspected. This study uses various machine learning methods to develop a root cause identification model based on the inspection result.\\n\\n\\nFindings\\nThe experimental results revealed that the wrong nozzle size could increase the mean and the standard deviation of component placement offset and the probability of component drop during the transfer process. Moreover, nozzle pick-up position can affect the rotated component placement offset. These root causes of defects can be traced back using machine learning methods.\\n\\n\\nPractical implications\\nThis study provides operators in surface mount technology assembly lines to understand the P&P machine error symptoms. The developed model can trace back the root causes of defects automatically in real line production.\\n\\n\\nOriginality/value\\nThe findings are expected to lead the regular preventive maintenance to data-driven predictive and reactive maintenance.\\n\",\"PeriodicalId\":49499,\"journal\":{\"name\":\"Soldering & Surface Mount Technology\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2021-08-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Soldering & Surface Mount Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1108/ssmt-03-2021-0007\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-03-2021-0007","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Defect patterns study of pick-and-place machine using automated optical inspection data
Purpose
This paper aims to study the component pick-and-place (P&P) defect patterns for different root causes based on automated optical inspection data and develop a root cause identification model using machine learning.
Design/methodology/approach
This study conducts experiments to simulate the P&P machine errors including nozzle size and nozzle pick-up position. The component placement qualities with different errors are inspected. This study uses various machine learning methods to develop a root cause identification model based on the inspection result.
Findings
The experimental results revealed that the wrong nozzle size could increase the mean and the standard deviation of component placement offset and the probability of component drop during the transfer process. Moreover, nozzle pick-up position can affect the rotated component placement offset. These root causes of defects can be traced back using machine learning methods.
Practical implications
This study provides operators in surface mount technology assembly lines to understand the P&P machine error symptoms. The developed model can trace back the root causes of defects automatically in real line production.
Originality/value
The findings are expected to lead the regular preventive maintenance to data-driven predictive and reactive maintenance.
期刊介绍:
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.