Study on Silane Coupling Agent Treated Silica Nanoparticles Filled High Performance Copper Clad Laminate

Efforts to improve the properties of composites have involved extensive studies regarding the effective incorporation of a polymer matrix and inorganic fillers. In this work, we generated a stable organosilica sol with high concentration and high purity by surface modification with silane coupling agents, then integrated it with an epoxy matrix. The silica nanoparticle/epoxy composite exhibited improved tensile strength because of the uniform distribution of silica in the matrix, as well as the interfacial chemical bonding between polymer and silica nanoparticles; these factors resulted in effective load transfer from matrix to fillers. Additionally, the application of copper-clad laminates (CCLs) with prepreg-containing silica nanoparticles led to substantial improvements in mechanical properties, including peel strength (0.46 kgf/cm) and storage modulus (30.0 GPa), compared with conventional CCLs lacking silica nanoparticles. These results suggest that prepregs containing surface-modified silica nanoparticles have great potential for use as printed circuit board substrate materials in high-performance electronics.