{"title":"用于电流源和电压源逆变器的功率半导体焊点的使用寿命估计","authors":"Hao Zou, Fang Xie, Bo-Sian Du, G. Kavithaa","doi":"10.1108/ssmt-05-2020-0018","DOIUrl":null,"url":null,"abstract":"Purpose\nThe purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.\n\n\nDesign/methodology/approach\nIn this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.\n\n\nFindings\nIt was found that inverter types highly affect the solder joint health during its nominal operating.\n\n\nOriginality/value\nThe authors confirm the originality of this paper.","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":" ","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2020-12-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters\",\"authors\":\"Hao Zou, Fang Xie, Bo-Sian Du, G. Kavithaa\",\"doi\":\"10.1108/ssmt-05-2020-0018\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Purpose\\nThe purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.\\n\\n\\nDesign/methodology/approach\\nIn this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.\\n\\n\\nFindings\\nIt was found that inverter types highly affect the solder joint health during its nominal operating.\\n\\n\\nOriginality/value\\nThe authors confirm the originality of this paper.\",\"PeriodicalId\":49499,\"journal\":{\"name\":\"Soldering & Surface Mount Technology\",\"volume\":\" \",\"pages\":\"\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2020-12-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Soldering & Surface Mount Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1108/ssmt-05-2020-0018\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-05-2020-0018","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Useful lifetime estimation of solder joints in power semiconductors employed in current source and voltage source inverters
Purpose
The purpose of this paper is to find the optimum inverter type as the solder joint reliability point of view.
Design/methodology/approach
In this paper, finite element model(ing) simulations supported with power cycling aging experiments were used to demonstrate the best inverter type as the solder joint reliability point of view.
Findings
It was found that inverter types highly affect the solder joint health during its nominal operating.
Originality/value
The authors confirm the originality of this paper.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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