Feng Wang, Fangfang Zhang, Qixiang Huang, M. Salmani
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An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems
Purpose
The purpose of this paper is to propose a method with capability of short-time implementation.
Design/methodology/approach
This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints.
Findings
A new method with good agreement with experimental tests has been proposed.
Originality/value
It is confirmed that paper is original.
期刊介绍：
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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