{"title":"包裹门控纳米线场效应晶体管","authors":"L. Wernersson, T. Bryllert, E. Lind, L. Samuelson","doi":"10.1109/IEDM.2005.1609324","DOIUrl":null,"url":null,"abstract":"Field-effect transistors (FETs) based on semiconductor nanowires (Bryllert et al., 2005) have the potential to improve certain aspects of existing planar FET technologies. The possibility to form wrap-gates gives an efficient gate coupling resulting in reduced drain-induced barrier lowering. Furthermore, lateral strain relaxation allows a new freedom in combining materials in heterostructures, where materials with different lattice constants can be combined without defects (Bjork et al., 2002). Since the transistor channel, unlike the planar FETs, is vertical, heterostructures may be used to tailor the bandstructure along the direction of current flow. In this paper, we demonstrate a new technology to fabricate vertical nanowire FETs in a process that almost exclusively relies on optical lithography and standard III-V processing techniques. We measure encouraging electrical data, including current saturation at Vds equiv 0.15 V (for Vg equiv 0 V) and low voltage operation Vth equiv -0.15 V, and present opportunities to improve the device performance by heterostructure design","PeriodicalId":13071,"journal":{"name":"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.","volume":"38 1","pages":"265-268"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Wrap-gated inas nanowire field-effect transistor\",\"authors\":\"L. Wernersson, T. Bryllert, E. Lind, L. Samuelson\",\"doi\":\"10.1109/IEDM.2005.1609324\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Field-effect transistors (FETs) based on semiconductor nanowires (Bryllert et al., 2005) have the potential to improve certain aspects of existing planar FET technologies. The possibility to form wrap-gates gives an efficient gate coupling resulting in reduced drain-induced barrier lowering. Furthermore, lateral strain relaxation allows a new freedom in combining materials in heterostructures, where materials with different lattice constants can be combined without defects (Bjork et al., 2002). Since the transistor channel, unlike the planar FETs, is vertical, heterostructures may be used to tailor the bandstructure along the direction of current flow. In this paper, we demonstrate a new technology to fabricate vertical nanowire FETs in a process that almost exclusively relies on optical lithography and standard III-V processing techniques. We measure encouraging electrical data, including current saturation at Vds equiv 0.15 V (for Vg equiv 0 V) and low voltage operation Vth equiv -0.15 V, and present opportunities to improve the device performance by heterostructure design\",\"PeriodicalId\":13071,\"journal\":{\"name\":\"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.\",\"volume\":\"38 1\",\"pages\":\"265-268\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-12-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2005.1609324\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2005.1609324","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
摘要
基于半导体纳米线的场效应晶体管(FET) (Bryllert et al., 2005)具有改进现有平面场效应晶体管技术某些方面的潜力。形成包闸的可能性提供了有效的闸耦合,从而减少了漏极引起的屏障降低。此外,横向应变松弛允许在异质结构中组合材料的新的自由,其中具有不同晶格常数的材料可以无缺陷地组合(Bjork等人,2002)。由于晶体管沟道与平面场效应管不同,是垂直的,因此异质结构可用于沿电流方向调整带结构。在本文中,我们展示了一种制造垂直纳米线场效应管的新技术,该技术几乎完全依赖于光学光刻和标准III-V加工技术。我们测量了令人鼓舞的电气数据,包括等效Vds为0.15 V时的电流饱和(等效Vg为0 V)和等效-0.15 V时的低压工作电压,并提出了通过异质结构设计提高器件性能的机会
Field-effect transistors (FETs) based on semiconductor nanowires (Bryllert et al., 2005) have the potential to improve certain aspects of existing planar FET technologies. The possibility to form wrap-gates gives an efficient gate coupling resulting in reduced drain-induced barrier lowering. Furthermore, lateral strain relaxation allows a new freedom in combining materials in heterostructures, where materials with different lattice constants can be combined without defects (Bjork et al., 2002). Since the transistor channel, unlike the planar FETs, is vertical, heterostructures may be used to tailor the bandstructure along the direction of current flow. In this paper, we demonstrate a new technology to fabricate vertical nanowire FETs in a process that almost exclusively relies on optical lithography and standard III-V processing techniques. We measure encouraging electrical data, including current saturation at Vds equiv 0.15 V (for Vg equiv 0 V) and low voltage operation Vth equiv -0.15 V, and present opportunities to improve the device performance by heterostructure design