高性能机电集成器件厚膜混合技术与聚合物增材制造的结合

Thomas Ackstaller, L. Lorenz, K. Nieweglowski, K. Bock
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引用次数: 4

摘要

为了构建高性能的3d光机电集成器件封装,我们演示了聚合物树脂在陶瓷基板上的直接立体平版印刷。研究了粘接的影响,找出了结构的尺寸下限,并测量了粘接强度。根据研究结果,可以选择合适的材料组合来创建3d光机电一体化设备的混合封装。一个光学耦合器的原型打印成功,并显示了一个可能的应用。
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Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices
In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.
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