Thomas Ackstaller, L. Lorenz, K. Nieweglowski, K. Bock
{"title":"高性能机电集成器件厚膜混合技术与聚合物增材制造的结合","authors":"Thomas Ackstaller, L. Lorenz, K. Nieweglowski, K. Bock","doi":"10.1109/ISSE.2019.8810205","DOIUrl":null,"url":null,"abstract":"In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"50 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices\",\"authors\":\"Thomas Ackstaller, L. Lorenz, K. Nieweglowski, K. Bock\",\"doi\":\"10.1109/ISSE.2019.8810205\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"50 1\",\"pages\":\"1-6\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810205\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810205","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices
In order to build high performance 3D-Opto-mechatronic integrated device packages, we demonstrate the direct stereolithographic printing of polymeric resins onto ceramic substrate. The effects of adhesion are examined, the lower size limit for structures is found and the adhesion strength is measured. With the results a suitable combination of materials can be chosen for creating a hybrid package for a 3D-Opto-mechatronic integrated device. A prototype of an optical coupler is printed successfully and shows one possible application.