{"title":"一个3×40Gb/s 28nm FDSOI CMOS前端阵列,灵敏度10mVPP,输出摆幅>4VPP","authors":"S. Shopov, S. Voinigescu","doi":"10.1109/ESSCIRC.2015.7313831","DOIUrl":null,"url":null,"abstract":"A versatile three-lane transceiver front-end is integrated in a production 28nm FDSOI CMOS technology. Each lane can operate at up to 40Gb/s data rate in receive mode with record 10mVPP sensitivity and 40dB gain, or up to 60Gb/s data rate in transmit mode with adjustable output swing between 2.6 and 4.3 VPP in a 50Ω load, as needed for a variety of silicon photonics and III-V optical modulators. The output stage can swing up to 100 mA at 60 Gb/s in 50Ω or 100fF capacitive loads. Single-ended CMOS inverter-based topologies are employed in all circuit blocks to minimize power consumption and to reduce the lane footprint to that of a ground-signal pad I/O. Even with the reduced footprint, special layout techniques enabled a lane-to-lane isolation better than 40 dB up to 55 GHz. The measured Tx-to-Rx dynamic range is larger than 54 dB at 40 Gb/s.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":"249 1","pages":"72-75"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A 3×40Gb/s 28nm FDSOI CMOS front-end array with 10mVPP sensitivity and >4VPP output swing\",\"authors\":\"S. Shopov, S. Voinigescu\",\"doi\":\"10.1109/ESSCIRC.2015.7313831\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A versatile three-lane transceiver front-end is integrated in a production 28nm FDSOI CMOS technology. Each lane can operate at up to 40Gb/s data rate in receive mode with record 10mVPP sensitivity and 40dB gain, or up to 60Gb/s data rate in transmit mode with adjustable output swing between 2.6 and 4.3 VPP in a 50Ω load, as needed for a variety of silicon photonics and III-V optical modulators. The output stage can swing up to 100 mA at 60 Gb/s in 50Ω or 100fF capacitive loads. Single-ended CMOS inverter-based topologies are employed in all circuit blocks to minimize power consumption and to reduce the lane footprint to that of a ground-signal pad I/O. Even with the reduced footprint, special layout techniques enabled a lane-to-lane isolation better than 40 dB up to 55 GHz. The measured Tx-to-Rx dynamic range is larger than 54 dB at 40 Gb/s.\",\"PeriodicalId\":11845,\"journal\":{\"name\":\"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)\",\"volume\":\"249 1\",\"pages\":\"72-75\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-11-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSCIRC.2015.7313831\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.2015.7313831","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 3×40Gb/s 28nm FDSOI CMOS front-end array with 10mVPP sensitivity and >4VPP output swing
A versatile three-lane transceiver front-end is integrated in a production 28nm FDSOI CMOS technology. Each lane can operate at up to 40Gb/s data rate in receive mode with record 10mVPP sensitivity and 40dB gain, or up to 60Gb/s data rate in transmit mode with adjustable output swing between 2.6 and 4.3 VPP in a 50Ω load, as needed for a variety of silicon photonics and III-V optical modulators. The output stage can swing up to 100 mA at 60 Gb/s in 50Ω or 100fF capacitive loads. Single-ended CMOS inverter-based topologies are employed in all circuit blocks to minimize power consumption and to reduce the lane footprint to that of a ground-signal pad I/O. Even with the reduced footprint, special layout techniques enabled a lane-to-lane isolation better than 40 dB up to 55 GHz. The measured Tx-to-Rx dynamic range is larger than 54 dB at 40 Gb/s.