金属-石墨烯和金属-磷烯界面缺陷辅助接触工程的第一性原理研究

J. Kumar, A. Meersha, Ansh, M. Shrivastava
{"title":"金属-石墨烯和金属-磷烯界面缺陷辅助接触工程的第一性原理研究","authors":"J. Kumar, A. Meersha, Ansh, M. Shrivastava","doi":"10.1109/SISPAD.2019.8870396","DOIUrl":null,"url":null,"abstract":"In this work we have studied bonding nature of Graphene and Phosphorene with metal (Pd) followed by carrier transport behavior and contact resistance engineering across the metal-Graphene and the metal-Phosphorene interfaces using Density Functional Theory (DFT) and Non Equilibrium Green’s Function (NEGF) computational methods. We have studied, how carrier transports at the interfaces is limited by van der Waals (vdW) gap across the interfaces and how the gap can be reduced by creating the Carbon vacancy (defect engineering) at the Graphene-Palladium interface. We have seen that the defect engineering enhances the Carbon-Palladium bond at the interface which reduces the van der Walls (vdW) gap, hence contact resistance due to corresponding reduction in the tunneling barrier width at the interface. We have also studied that the defect engineering (Phosphorous vacancy) at the Phosphorene-Palladium interface is not effective as Graphene-Palladium interface because it has less interfacial (vdW) gap than Graphene-Palladium interface intrinsically.","PeriodicalId":6755,"journal":{"name":"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"8 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A First Principle Insight into Defect Assisted Contact Engineering at the Metal-Graphene and Metal-Phosphorene Interfaces\",\"authors\":\"J. Kumar, A. Meersha, Ansh, M. Shrivastava\",\"doi\":\"10.1109/SISPAD.2019.8870396\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work we have studied bonding nature of Graphene and Phosphorene with metal (Pd) followed by carrier transport behavior and contact resistance engineering across the metal-Graphene and the metal-Phosphorene interfaces using Density Functional Theory (DFT) and Non Equilibrium Green’s Function (NEGF) computational methods. We have studied, how carrier transports at the interfaces is limited by van der Waals (vdW) gap across the interfaces and how the gap can be reduced by creating the Carbon vacancy (defect engineering) at the Graphene-Palladium interface. We have seen that the defect engineering enhances the Carbon-Palladium bond at the interface which reduces the van der Walls (vdW) gap, hence contact resistance due to corresponding reduction in the tunneling barrier width at the interface. We have also studied that the defect engineering (Phosphorous vacancy) at the Phosphorene-Palladium interface is not effective as Graphene-Palladium interface because it has less interfacial (vdW) gap than Graphene-Palladium interface intrinsically.\",\"PeriodicalId\":6755,\"journal\":{\"name\":\"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)\",\"volume\":\"8 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SISPAD.2019.8870396\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2019.8870396","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

在这项工作中,我们研究了石墨烯和磷烯与金属(Pd)的键合性质,然后利用密度泛函理论(DFT)和非平衡格林函数(NEGF)计算方法研究了金属-石墨烯和金属-磷烯界面上的载流子输运行为和接触电阻工程。我们研究了界面上的载流子输运如何受到界面上范德华间隙的限制,以及如何通过在石墨烯-钯界面上创造碳空位(缺陷工程)来减少这种间隙。我们已经看到,缺陷工程增强了界面处的碳-钯键,减小了范德华斯(vdW)间隙,从而减小了界面处的隧道势垒宽度,从而减少了接触电阻。我们还研究了在磷-钯界面处的缺陷工程(磷空位)并不像石墨烯-钯界面那样有效,因为它具有比石墨烯-钯界面更小的界面间隙(vdW)。
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A First Principle Insight into Defect Assisted Contact Engineering at the Metal-Graphene and Metal-Phosphorene Interfaces
In this work we have studied bonding nature of Graphene and Phosphorene with metal (Pd) followed by carrier transport behavior and contact resistance engineering across the metal-Graphene and the metal-Phosphorene interfaces using Density Functional Theory (DFT) and Non Equilibrium Green’s Function (NEGF) computational methods. We have studied, how carrier transports at the interfaces is limited by van der Waals (vdW) gap across the interfaces and how the gap can be reduced by creating the Carbon vacancy (defect engineering) at the Graphene-Palladium interface. We have seen that the defect engineering enhances the Carbon-Palladium bond at the interface which reduces the van der Walls (vdW) gap, hence contact resistance due to corresponding reduction in the tunneling barrier width at the interface. We have also studied that the defect engineering (Phosphorous vacancy) at the Phosphorene-Palladium interface is not effective as Graphene-Palladium interface because it has less interfacial (vdW) gap than Graphene-Palladium interface intrinsically.
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