利用TFT转移技术制造玻璃和塑料基板上的rfcpu

H. Dembo, Y. Kurokawa, T. Ikeda, S. Iwata, K. Ohshima, J. Ishii, T. Tsurume, E. Sugiyama, D. Yamada, A. Isobe, S. Saito, K. Dairiki, N. Kusumoto, Y. Shionoiri, T. Atsumi, M. Fujita, H. Kobayashi, H. Takashina, Y. Yamashita, S. Yamazaki
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引用次数: 13

摘要

的基础上制造一个CPU的玻璃作为数字电路在b .李et al。(2003)和t . Ikeda et al。(2004),以及灵活的CPU使用TFT转移的制造技术提出了t .高山et al .(2004),我们已经成功地开发的世界上第一个灵活RFCPUs(8位、被动类型)通过添加CPU天线,一个模拟电路,一个加密函数和一个射频识别功能,使用频率为13.56兆赫的射频信号运作
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RFCPUs on glass and plastic substrates fabricated by TFT transfer technology
On the basis of the fabrication of a CPU on glass as a digital circuit presented in B. Lee et al. (2003) and T. Ikeda et al. (2004), as well as the fabrication of a flexible CPU using a TFT transfer technology presented in T. Takayama et al. (2004), we have succeeded in the development of the world's first flexible RFCPUs (8bit, passive type) by adding to the CPU an antenna, an analog circuit, an encryption function and an RFID function, which operate using an RF signal with a frequency of 13.56MHz
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