片上系统互连串扰的故障建模与仿真

M. Cuviello, S. Dey, Xiaoliang Bai, Yi Zhao
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引用次数: 244

摘要

采用超深亚微米(DSM)技术和GHz时钟频率的片上系统(soc)已经在1997年SIA路线图中得到了预测。最近的研究和本文报道的实验表明,在GHz DSM芯片的长片上互连中存在显著的串扰效应。认识到在GHz SOC中高速、可靠互连的重要性,我们在本文中解决了由总线串扰和SOC组件之间互连引起的故障和延迟错误的测试问题。由于不可能明确测试所有可能导致SOC互连串扰错误的工艺变化和缺陷,因此我们提出了一个抽象模型,即最大侵略者(MA)故障模型及其测试要求。该模型的吸引人之处在于它可以抽象出具有线性故障数的互连中的串扰缺陷,而相应的MA测试则完全覆盖了与互连交叉耦合电容相关的所有级别缺陷。提出了一种spice级故障模拟方法,该方法可以模拟潜在指数数量缺陷的一小部分。仿真方法还可以验证所提出的故障模型和结果测试集。
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Fault modeling and simulation for crosstalk in system-on-chip interconnects
System-on-chips (SOCs) using ultra deep sub-micron (DSM) technologies and GHz clock frequencies have been predicted by the 1997 SIA Road Map. Recent studies, as well as experiments reported in this paper, show significant crosstalk effects in long on-chip interconnects of GHz DSM chips. Recognizing the importance of high-speed, reliable interconnects in GHz SOCs, we address in this paper the problem of testing for glitch and delay errors caused by crosstalk in buses and interconnects between components of a SOC. Since it is not possible to explicitly test for all the possible process variations and defects that can lead to crosstalk errors in SOC interconnects, we present an abstract model, Maximum Aggressor (MA) fault model, and its test requirements. The attractiveness of the model is that it can abstract crosstalk defects in interconnects with a linear number of faults, while the corresponding MA tests provide complete coverage for all level defects related to cross-coupling capacitance the interconnects. A SPICE-level fault simulation methodology is presented which allows simulation of a small subset of the potentially exponential number of defects. The simulation methodology also enables validation of the proposed fault model and the resulting test set.
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