数字集成电路设计方法中的互连寄生提取

M. Kamon, S. McCormick, K. Sheperd
{"title":"数字集成电路设计方法中的互连寄生提取","authors":"M. Kamon, S. McCormick, K. Sheperd","doi":"10.1109/ICCAD.1999.810653","DOIUrl":null,"url":null,"abstract":"Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis and extraction methodology on three levels: coarse extraction to guide synthesis, detailed extraction for full-chip analysis, and full 3D analysis for critical nets. We will also describe the electrical issues caused by parasitics and how they have, and will be, influenced by changing technology. The importance of model order reduction will be described as well as methodologies at the synthesis stage for avoiding parasitic problems.","PeriodicalId":6414,"journal":{"name":"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)","volume":"1 1","pages":"223-230"},"PeriodicalIF":0.0000,"publicationDate":"1999-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Interconnect parasitic extraction in the digital IC design methodology\",\"authors\":\"M. Kamon, S. McCormick, K. Sheperd\",\"doi\":\"10.1109/ICCAD.1999.810653\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis and extraction methodology on three levels: coarse extraction to guide synthesis, detailed extraction for full-chip analysis, and full 3D analysis for critical nets. We will also describe the electrical issues caused by parasitics and how they have, and will be, influenced by changing technology. The importance of model order reduction will be described as well as methodologies at the synthesis stage for avoiding parasitic problems.\",\"PeriodicalId\":6414,\"journal\":{\"name\":\"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)\",\"volume\":\"1 1\",\"pages\":\"223-230\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD.1999.810653\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.1999.810653","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15

摘要

准确的互连分析不仅对布局后验证,而且对综合也至关重要。本教程探讨互连分析和提取方法在三个层面:粗提取,以指导合成,详细提取全芯片分析,并为关键网全3D分析。我们还将描述由寄生虫引起的电气问题,以及它们如何受到不断变化的技术的影响。本文将描述模型降阶的重要性,以及在综合阶段避免寄生问题的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Interconnect parasitic extraction in the digital IC design methodology
Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis and extraction methodology on three levels: coarse extraction to guide synthesis, detailed extraction for full-chip analysis, and full 3D analysis for critical nets. We will also describe the electrical issues caused by parasitics and how they have, and will be, influenced by changing technology. The importance of model order reduction will be described as well as methodologies at the synthesis stage for avoiding parasitic problems.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Least fixpoint approximations for reachability analysis Performance optimization using separator sets A scalable substrate noise coupling model for mixed-signal ICs JMTP: an architecture for exploiting concurrency in embedded Java applications with real-time considerations Electromagnetic parasitic extraction via a multipole method with hierarchical refinement
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1