{"title":"数字集成电路设计方法中的互连寄生提取","authors":"M. Kamon, S. McCormick, K. Sheperd","doi":"10.1109/ICCAD.1999.810653","DOIUrl":null,"url":null,"abstract":"Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis and extraction methodology on three levels: coarse extraction to guide synthesis, detailed extraction for full-chip analysis, and full 3D analysis for critical nets. We will also describe the electrical issues caused by parasitics and how they have, and will be, influenced by changing technology. The importance of model order reduction will be described as well as methodologies at the synthesis stage for avoiding parasitic problems.","PeriodicalId":6414,"journal":{"name":"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)","volume":"1 1","pages":"223-230"},"PeriodicalIF":0.0000,"publicationDate":"1999-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Interconnect parasitic extraction in the digital IC design methodology\",\"authors\":\"M. Kamon, S. McCormick, K. Sheperd\",\"doi\":\"10.1109/ICCAD.1999.810653\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis and extraction methodology on three levels: coarse extraction to guide synthesis, detailed extraction for full-chip analysis, and full 3D analysis for critical nets. We will also describe the electrical issues caused by parasitics and how they have, and will be, influenced by changing technology. The importance of model order reduction will be described as well as methodologies at the synthesis stage for avoiding parasitic problems.\",\"PeriodicalId\":6414,\"journal\":{\"name\":\"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)\",\"volume\":\"1 1\",\"pages\":\"223-230\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCAD.1999.810653\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCAD.1999.810653","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnect parasitic extraction in the digital IC design methodology
Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis and extraction methodology on three levels: coarse extraction to guide synthesis, detailed extraction for full-chip analysis, and full 3D analysis for critical nets. We will also describe the electrical issues caused by parasitics and how they have, and will be, influenced by changing technology. The importance of model order reduction will be described as well as methodologies at the synthesis stage for avoiding parasitic problems.