XQFP封装上的铜线偏离中心球和第二次粉碎债券问题解决方案

Jun Li, Ming-chuan Han, Mei Liu, Hangduo Wang, Zhijian Wang
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引用次数: 1

摘要

在过去的几年里,铜线的接受和实施已经成为一种流行和强制性的,特别是在这几年黄金价格飙升之后。与金丝相比,铜丝具有导电性好、导热性好、机械强度高、成本低、可靠性好等特点。但在大规模生产中,由于众所周知的铜线缺点,我们可能无法达到理想的性能和可制造性。一是硬度大,二是易氧化。这些缺点给铜线带来了无粘、弱粘、缺球、离球、弹坑、短尾、断键等挑战。本文对离球和二次断键问题进行了研究。选取一辆细间距为66um、粘结垫金属厚度为1.2um的试验车辆,对球离心及二次粉碎粘结机理进行研究。首先进行鱼骨分析,找出根本原因。鱼骨分析显示,连接过程中钢丝尾、EFO电流设置和引线框架浮动被怀疑是导致偏离中心球和第二次粉碎连接的根本原因。其次,筛选了几种不同OR、尖端大小和FA的毛细管类型。根据筛选结果,完成了毛细管设计。其次,对二键参数进行DOE求解,解决了球偏心和二键粉碎问题。影响因素有二键力、二键USG、二键磨砂偏移和相。针脚拉力、二键宽度和二键形状异常是响应。根据DOE结果建立了第二个键参数。最后,对EFO参数进行DOE分析。影响因素是EFO时间和EFO电流。FAB尺寸、FAB圆度、FAB异常均为响应。此外,还对第二键参数进行了DOE验证。二键力、二键USG和二键搓洗偏移量是影响因素,FAB尺寸、FAB圆度、FAB异常和缝线拉力是响应因素。基于DOE结果建立了EFO参数窗口。采用优化后的FAB和二键参数设计了确认工序。在大批量生产中,没有发现偏离中心球和第二次粉碎债券问题。二次键参数优化对解决球偏心和二次扣杀键问题有重要作用。
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Copper wire off-center ball and 2nd smash bond issue resolution on XQFP package
For the past years, acceptance and implementation of copper wire has been become popular and mandatory, especially after gold price soaring for past these years. As compared to gold wire, copper wire poses better electrical conductivity, better thermal conductivity, higher mechanical strength, lower cost and better reliability and so on. But in mass production, we may not be able to achieve desirable performance and manufacturability due to the well-known disadvantages of copper wire. One is its greater hardness, another is being easy to be oxidized. These disadvantages bring challenge to copper wire such as none stick, weak bonding, missing ball, off-center ball, cratering, short tail, smash bond etc.In this paper, off-center ball and 2nd smash bond issue were investigated. a test vehicle with 66um fine pitch and 1.2um bond pad metal thickness was selected as vehicle to study the mechanism of off-center ball and 2nd smash bond issue. First, fish bone analysis was conducted to dig out root cause. Fish bone analysis shows wire tail, EFO current setting and lead frame floating during bonding were suspected to the root cause to the off-center ball and 2nd smash bond. Second, several types of capillary with different OR, tip size and FA were screened. Based on screen result, capillary design was finalized. Second, a DOE was conducted to 2nd bond parameter to resolve off-center ball and 2nd smash bond issue. The factors are 2nd bond force and 2nd bond USG, and 2nd bond scrub offset and phase. Stitch pull strength, 2nd bond width and abnormal 2nd bond shape are responses. 2nd bond parameter was established based on DOE result. Last, EFO parameter DOE was conducted. The factors are EFO time and EFO current. FAB size, FAB roundness and abnormal FAB are responses. Besides, a DOE was conducted to verify 2nd bond parameter. 2nd bond force and 2nd bond USG, and 2nd bond scrub offset are factors, FAB size, FAB roundness, abnormal FAB and stitch pull are responses. EFO parameter window was established based on DOE result. Confirmation run was designed with optimized FAB and 2nd bond parameter. No off-center ball and 2nd smash bond issue were found in high volume production. 2nd bond parameter optimization plays a great role in resolving off-center ball and 2nd smash bond issue.
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