B. Debaillie, B. V. Liempd, B. Hershberg, J. Craninckx, K. Rikkinen, D. V. D. Broek, E. Klumperink, B. Nauta
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引用次数: 21
摘要
带内全双工是一种很有前途的空中接口技术,可以解决下一代(5G)移动网络的几个关键挑战。在同一频段内同时收发,提高了吞吐量和频谱效率,减少了空口延迟。然而,它在5G系统中的实现限制了全双工收发器的设计要求。在5G应用的框架下,提出并评估了两种模拟集成电路解决方案。第一个设计是采用65nm CMOS实现的自干扰消除前端,第二个设计是采用0.18μm RF SOI CMOS实现的电平衡双工器。在5G的背景下,这两种设计都很有吸引力;它们允许密集集成,可配置以支持替代标准和传统标准,与传统天线兼容,并为无线通信提供有吸引力的全双工性能。
In-band full-duplex transceiver technology for 5G mobile networks
In-band full-duplex is a promising air interface technique to tackle several of the key challenges of next generation (5G) mobile networks. Simultaneous transmission and reception in the same frequency band increases the throughput and spectral efficiency, and reduces the air interface delay. Its implementation in 5G systems, however, restrains the full-duplex transceiver design requirements. Two analog integrated circuit solutions are presented and evaluated in the frame of 5G applications. The first design is a self-interference cancelling front-end implemented in 65nm CMOS, and the second design is an electrical-balance duplexer implemented in 0.18μm RF SOI CMOS. Both designs are attractive in the context of 5G; they allow dense integration, are configurable to support alternative and legacy standards, are compatible with conventional antenna(s), and they provide an attractive full-duplex performance for wireless communications.