互连缩放对CAD的影响

R. Ho, K. Mai, H. Kapadia, M. Horowitz
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引用次数: 24

摘要

互连扩展到深亚微米工艺对当今的CAD流程提出了许多挑战。D. Sylvester和K. Keutzer(1998)最近的一项分析检查了平均长度导线在缩放下的行为,并得出了有争议的结论,即当前的CAD工具足以用于未来的模块级设计。我们发现平均长度导线的缩放对技术假设很敏感,尽管在所有合理的缩放假设下它们的行为变化很小。然而,只检查平均长度的电线是乐观的,因为长电线是导致CAD工具异常的主要原因。在一个固定复杂度的模块中,在乐观和悲观的扩展假设下,长导线的数量都会随着扩展而缓慢增加。更重要的是,随着整体模具容量呈指数级增长,设计中的模块数量和电线总数也将呈指数级增长。因此,如果设计团队的规模和每个设计人员的工作量保持相对恒定,未来的CAD工具将需要比当前的工具更好地处理长电线,以减少需要设计人员干预的电线的百分比。
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Interconnect scaling implications for CAD
Interconnect scaling to deep submicron processes presents many challenges to today's CAD flows. A recent analysis by D. Sylvester and K. Keutzer (1998) examined the behavior of average length wires under scaling, and controversially concluded that current CAD tools are adequate for future module-level designs. We show that average length wire scaling is sensitive to the technology assumptions, although the change in their behavior is small under all reasonable scaling assumptions. However, examining only average length wires is optimistic, since long wires are the ones that primarily cause CAD tool exceptions. In a module of fixed complexity, under both optimistic and pessimistic scaling assumptions, the number of long wires will increase slowly with scaling. More importantly, as the overall die capacity grows exponentially, the number of modules and thus the total number of wires in a design will also increase exponentially. Thus, if the design team size and per-designer workload is to remain relatively constant, future CAD tools will need to handle long wires much better than current tools to reduce the percentage of wires that require designer intervention.
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