{"title":"电力电子模块的三维热建模与验证","authors":"N. Vakrilov, A. Stoynova, B. Bonev","doi":"10.1109/ISSE.2019.8810307","DOIUrl":null,"url":null,"abstract":"In this paper, a comparative analysis of two methods for evaluation of the thermal behavior of metal core printed circuit boards (MCPCB)for a LED lighting device is performed-modeling and measuring. Digital modeling and CFD simulations capabilities for the prognosis of heat-physical processes in different PCBs construction of LED modules and experimental capabilities of noncontact measurements methods are investigated and compared. Correlations between thermal surface distribution and design parameters obtained with digital thermal models are verified by thermographic measurements. It has been shown that a verification process of up to 5 % accuracy is obtained by taking standard measures to compensate the main factors affecting the thermography.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"98 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"3D Thermal Modelling and Verification of Power Electronic Modules\",\"authors\":\"N. Vakrilov, A. Stoynova, B. Bonev\",\"doi\":\"10.1109/ISSE.2019.8810307\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a comparative analysis of two methods for evaluation of the thermal behavior of metal core printed circuit boards (MCPCB)for a LED lighting device is performed-modeling and measuring. Digital modeling and CFD simulations capabilities for the prognosis of heat-physical processes in different PCBs construction of LED modules and experimental capabilities of noncontact measurements methods are investigated and compared. Correlations between thermal surface distribution and design parameters obtained with digital thermal models are verified by thermographic measurements. It has been shown that a verification process of up to 5 % accuracy is obtained by taking standard measures to compensate the main factors affecting the thermography.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"98 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810307\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810307","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D Thermal Modelling and Verification of Power Electronic Modules
In this paper, a comparative analysis of two methods for evaluation of the thermal behavior of metal core printed circuit boards (MCPCB)for a LED lighting device is performed-modeling and measuring. Digital modeling and CFD simulations capabilities for the prognosis of heat-physical processes in different PCBs construction of LED modules and experimental capabilities of noncontact measurements methods are investigated and compared. Correlations between thermal surface distribution and design parameters obtained with digital thermal models are verified by thermographic measurements. It has been shown that a verification process of up to 5 % accuracy is obtained by taking standard measures to compensate the main factors affecting the thermography.
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