采用插入馈电方法提高2.45 GHz微带天线性能的分析

A. Baki, Md. Nurur Rahman, Shawon Kumar Mondal
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引用次数: 7

摘要

微带贴片天线(MSA)有许多应用,如飞机、生物医学工程、联网车辆、移动电话、卫星、智能电网和航天器。单MSA或MSAA阵列(MSAA)需要低成本的材料和简单廉价的制造技术。在现代高精度印刷电路技术的帮助下,可以制造出与微波单片集成电路(MMIC)设计兼容的廉价且坚固的MSA/MSAA。矩形贴片是最常用的贴片之一,其阻抗匹配的馈电技术不同。插入馈电矩形贴片不需要任何额外的复杂的微波电路。在三维仿真软件的帮助下,可以很容易地优化插入进给机构。虽然有一些研究论文是关于插入式矩形MSAA的,但对插入式MSAA的研究很少。本文采用FR-4基片和空气基片对2.45 GHz频段的边缘馈电和插入馈电MSA/MSAA进行了比较分析。研究结果表明,在综合考虑天线的方向性、增益、带宽和回波损耗的情况下,采用空气衬底的插入馈电MSA具有更好的性能。虽然FR4衬底价格便宜,但采用FR-4衬底可使MSAA微型化。
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Analysis of Performance-Improvement of Microstrip Antenna at 2.45 GHz Through Inset Feed Method
Microstrip patch antenna (MSA) has numerous applications such as aircraft, biomedical engineering, connected vehicles, cellular phones, satellites, smart grid, and spacecraft. Single MSA or MSA Array (MSAA) require low-cost materials with simple and inexpensive fabrication techniques. With the help of modern and highly precise printed-circuit technology it is possible to fabricate inexpensive and robust MSA/MSAA, which are compatible with microwave monolithic integrated circuit (MMIC) designs. Rectangular patch, one of the most popular patches, has different feeding techniques for impedance matching. Inset fed rectangular patch does not require any additional complex microwave circuit. Inset feeding mechanism can easily be optimized with the help of 3D simulation software. Very few investigations are made on inset fed MSAA, though several research papers can be found on inset fed rectangular MSA. In this paper a comparative analysis of edge fed and inset fed MSA/MSAA at 2.45 GHz frequency band is done using FR-4 and air substrates. It was found that the inset fed MSA with air substrate performs better when the directivities, gains, bandwidths and return losses are considered. Though FR4 substrate is cheap and miniaturization of MSAA is better with FR-4 substrate.
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