太赫兹应用的硅微加工技术

2012 IEEE Silicon Nanoelectronics Workshop (SNW) Pub Date : 2012-06-10 DOI:10.1109/SNW.2012.6243285

C. Jung-Kubiak, J. Gill, T. Reck, C. Lee, J. Siles, G. Chattopadhyay, R. Lin, K. Cooper, I. Mehdi

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引用次数: 12

摘要

硅微加工技术自然适合制造太赫兹元件，其中精度和准确性是必不可少的。我们在这里报告了鲁棒微加工技术的发展，以实现亚毫米波区域的新型有源和无源元件。这些特性将使大尺寸亚毫米波外差阵列和太赫兹区域的3-D集成成为可能，在太赫兹区域，传统加工难以制造电路和结构。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Silicon microfabrication technologies for THz applications

Silicon micromachining technology is naturally suited for making THz components, where precision and accuracy are essentials. We report here the development of robust micromachining techniques to enable novel active and passive components in the submillimeter-wave region. These features will enable large format submillimeter-wave heterodyne arrays and 3-D integration in the THz region, where fabricating circuits and structures becomes difficult with conventional machining.

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2012 IEEE Silicon Nanoelectronics Workshop (SNW)

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