Research on Preparation Technology of Nano Glass-Particles for High Density TGV Application

This paper reports a batch-mode preparation process of nano glass-particles for high density through glass via application. Compared to the state of the through glass via art, this preparation process allows the electrodes and the packaged structure to be same material, as well as the gap between the packaging electrodes to be less than 1 μm in theory. This process produces nano glass-particles in batches with wet ball grinding technology, and the purity of nano glass-particles can reach to be over 95%. The glass particles are filled in 20 μm electrodes gaps, and a high temperature step reflows the glass particles to a bulk. A high-density silicon column array is hermetically sealed to illustrate application of the process.