J. Zhan, C. Yang, X. Wang, T. Ren, A. Wang, Y. Yang, L. T. Liu, L. Yang
{"title":"CMOS中纳米粉末磁芯垂直堆叠螺旋射频电感","authors":"J. Zhan, C. Yang, X. Wang, T. Ren, A. Wang, Y. Yang, L. T. Liu, L. Yang","doi":"10.1109/EDSSC.2011.6117668","DOIUrl":null,"url":null,"abstract":"This paper reports a novel concept of vertically stacked-spiral RF inductor with integrated nano-powder-magnetic-core in standard CMOS. Prototype inductors in a foundry 0.18µm 6-metal CMOS and a post-CMOS backend process module (i.e., CMOS+) are fabricated and measured. Result shows the proof-of-concept designs greatly increase the inductance, L, by up to 34% and the factor, Q, by 62% over a multi-GHz frequency range.","PeriodicalId":6363,"journal":{"name":"2011 IEEE International Conference of Electron Devices and Solid-State Circuits","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Nano-powder-magnetic-core vertically stacked-spiral RF inductor in CMOS\",\"authors\":\"J. Zhan, C. Yang, X. Wang, T. Ren, A. Wang, Y. Yang, L. T. Liu, L. Yang\",\"doi\":\"10.1109/EDSSC.2011.6117668\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports a novel concept of vertically stacked-spiral RF inductor with integrated nano-powder-magnetic-core in standard CMOS. Prototype inductors in a foundry 0.18µm 6-metal CMOS and a post-CMOS backend process module (i.e., CMOS+) are fabricated and measured. Result shows the proof-of-concept designs greatly increase the inductance, L, by up to 34% and the factor, Q, by 62% over a multi-GHz frequency range.\",\"PeriodicalId\":6363,\"journal\":{\"name\":\"2011 IEEE International Conference of Electron Devices and Solid-State Circuits\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International Conference of Electron Devices and Solid-State Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDSSC.2011.6117668\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Conference of Electron Devices and Solid-State Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2011.6117668","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Nano-powder-magnetic-core vertically stacked-spiral RF inductor in CMOS
This paper reports a novel concept of vertically stacked-spiral RF inductor with integrated nano-powder-magnetic-core in standard CMOS. Prototype inductors in a foundry 0.18µm 6-metal CMOS and a post-CMOS backend process module (i.e., CMOS+) are fabricated and measured. Result shows the proof-of-concept designs greatly increase the inductance, L, by up to 34% and the factor, Q, by 62% over a multi-GHz frequency range.