{"title":"通过栅极-漏极和栅极-衬底电容测量分析mosfet中热载子引起的退化","authors":"C.T. Hsu, M. Lau, Y. Yeow, Z. Yao","doi":"10.1109/RELPHY.2000.843897","DOIUrl":null,"url":null,"abstract":"In this paper we describe and demonstrate the use of gate-to-drain capacitance (C/sub gd/) measurements at cryogenic temperature as a tool to characterize hot-carrier-induced charge centers. Also a new method based on gate-to-substrate capacitance (C/sub gb/), validated by means of two-dimensional numerical simulation, is proposed to extract the spatial distribution of oxide interface charges with reasonable accuracy.","PeriodicalId":6387,"journal":{"name":"2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2000-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Analysis of hot-carrier-induced degradation in MOSFETs by gate-to-drain and gate-to-substrate capacitance measurements\",\"authors\":\"C.T. Hsu, M. Lau, Y. Yeow, Z. Yao\",\"doi\":\"10.1109/RELPHY.2000.843897\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we describe and demonstrate the use of gate-to-drain capacitance (C/sub gd/) measurements at cryogenic temperature as a tool to characterize hot-carrier-induced charge centers. Also a new method based on gate-to-substrate capacitance (C/sub gb/), validated by means of two-dimensional numerical simulation, is proposed to extract the spatial distribution of oxide interface charges with reasonable accuracy.\",\"PeriodicalId\":6387,\"journal\":{\"name\":\"2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.2000.843897\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.2000.843897","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analysis of hot-carrier-induced degradation in MOSFETs by gate-to-drain and gate-to-substrate capacitance measurements
In this paper we describe and demonstrate the use of gate-to-drain capacitance (C/sub gd/) measurements at cryogenic temperature as a tool to characterize hot-carrier-induced charge centers. Also a new method based on gate-to-substrate capacitance (C/sub gb/), validated by means of two-dimensional numerical simulation, is proposed to extract the spatial distribution of oxide interface charges with reasonable accuracy.