使用SnAu探针熔接触点

K. Kataoka, K. Inoue, T. Itoh, T. Suga
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摘要

本文报道了利用铝电极与锡或锡金合金制成的探针之间的摩擦现象的接触过程。下一代大规模集成电路的测试探测需要低接触力的铝电极接触方法。钨或镍制成的测试探头适用于与氧化铝机械破碎接触。然而,当这些硬探头用于熔接过程时,铝屑附着在探头上,接触数百次后发生触点失效。为了解决这一问题,本文对软探头的低力接触特性进行了研究。发现在接触区域产生锡和铝的混合物或合金,并在接触断开后留在探针和铝电极上。此外,锡金合金制成的探针积累的铝屑较少,接触电阻在1000次接触后仍低于10 ω。
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Fritting Contact Using SnAu probe
We report on the contact process utilizing fritting phenomena between Al electrode and probes made of tin or tin gold alloy. The contact method with low contact force on Al electrodes is required for test probing of LSI for the next generation. The test probes made of tungsten or nickel are suitable for making contact with mechanical breaking of aluminum oxide. However, when these hard probes are used for fritting contact process, aluminum debris adheres to the probes and the contact failure occurs after several hundred contacts. In order to solve this problem, the low-force contact properties of soft probes are investigated in this paper. It was found that the mixture or alloy of tin and aluminum is generated in the contact area and remains on both the probe and the aluminum electrode after breaking the contact. Moreover, the probe made of tin-gold alloy is found to accumulate less aluminum debris and the contact resistance remains lower than 10 Omega after 1,000 contacts.
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