{"title":"PCB翘曲的讨论与失效分析","authors":"Ying Yang","doi":"10.1109/ICEPT47577.2019.245186","DOIUrl":null,"url":null,"abstract":"In current trend of miniaturization and integration of electronic devices, surface mount technology process puts higher demands on the demands on the flatness of printed circuit boards. It is a very important topic to minimize the warpage of PCB by optimizing process technology. This article discusses the main causes of PCB warpage and presents a failure analysis case for PCB warpage.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"16 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Discussion and failure analysis of PCB warpage\",\"authors\":\"Ying Yang\",\"doi\":\"10.1109/ICEPT47577.2019.245186\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In current trend of miniaturization and integration of electronic devices, surface mount technology process puts higher demands on the demands on the flatness of printed circuit boards. It is a very important topic to minimize the warpage of PCB by optimizing process technology. This article discusses the main causes of PCB warpage and presents a failure analysis case for PCB warpage.\",\"PeriodicalId\":6676,\"journal\":{\"name\":\"2019 20th International Conference on Electronic Packaging Technology(ICEPT)\",\"volume\":\"16 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 20th International Conference on Electronic Packaging Technology(ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT47577.2019.245186\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT47577.2019.245186","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In current trend of miniaturization and integration of electronic devices, surface mount technology process puts higher demands on the demands on the flatness of printed circuit boards. It is a very important topic to minimize the warpage of PCB by optimizing process technology. This article discusses the main causes of PCB warpage and presents a failure analysis case for PCB warpage.
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