Thermal Property Evaluation of TSV interposer Embedded Microfluidics for Cooling 2.5D Integrated High Power IC Device

For cooling the 2.5D integrated high power IC device, this paper present a TSV interposer embedded parallel linear microchannels, demonstrate its assembly and thermal property evaluation. The sample is about 9.45 mm  9.5 mm in size, with liner microchannel 100 μm/100 μm in the width/space, 300 μm in the depth, a symmetric flow guiding structure arranged in inlet/outlet region. TSV interposer embedded microchannel is fabricated with DRIE process and Si-Si direct bonding process. For thermal property evaluation, a customized high power IC chip with on site temperature sensor is integrated on the TSV interposer and wired by PCB board. According to the current test results, when the equivalent thermal flux input density is risen to 283 w/cm2, a total thermal input about 66.55 W, the DI wafer is set at a flow rate of 100 ml/min, the temperature rise to 95.1°C, and the pressure drop is 40 Kpa, which is preliminarily verified that it has a good cooling capability.