{"title":"采用混合印刷技术对封装BGA, LGA，倒装芯片，FI WLCSP, FO WLCSP到Star Flex PCB的复杂元件进行可持续和安全的焊接","authors":"V. Tsenev","doi":"10.1109/ISSE.2019.8810279","DOIUrl":null,"url":null,"abstract":"The application of hybrid printing for the sustainable and secure soldering of complex components with package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to the Star Flex PCB is presented. Several types of solder pastes can be applied by means of hybrid print in a single printing process, which in a single reflow process allows different soldering times for different components of the board on which various thermosensitive components may be placed. This allows to obtain low-void solder of thermosensitive or complex components. Experimental results are presented using different solder pastes and various complex components. The analysis was done using microscopy and Xray imaging/analysis.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"122 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Sustainable and Secure Soldering of Complex Components with Package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to Star Flex PCB Using Hybrid Printing\",\"authors\":\"V. Tsenev\",\"doi\":\"10.1109/ISSE.2019.8810279\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The application of hybrid printing for the sustainable and secure soldering of complex components with package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to the Star Flex PCB is presented. Several types of solder pastes can be applied by means of hybrid print in a single printing process, which in a single reflow process allows different soldering times for different components of the board on which various thermosensitive components may be placed. This allows to obtain low-void solder of thermosensitive or complex components. Experimental results are presented using different solder pastes and various complex components. The analysis was done using microscopy and Xray imaging/analysis.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"122 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810279\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810279","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Sustainable and Secure Soldering of Complex Components with Package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to Star Flex PCB Using Hybrid Printing
The application of hybrid printing for the sustainable and secure soldering of complex components with package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to the Star Flex PCB is presented. Several types of solder pastes can be applied by means of hybrid print in a single printing process, which in a single reflow process allows different soldering times for different components of the board on which various thermosensitive components may be placed. This allows to obtain low-void solder of thermosensitive or complex components. Experimental results are presented using different solder pastes and various complex components. The analysis was done using microscopy and Xray imaging/analysis.
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