{"title":"紧凑的建模透视-桥梁到工业应用","authors":"M. Miura-Mattausch","doi":"10.1109/SISPAD.2019.8870471","DOIUrl":null,"url":null,"abstract":"This paper summarizes briefly compact-model development history, which is characterized by the evolution into the role as a bridge between devices and circuits. It is demonstrated that the task of predicting circuitry performance accurately has been realized by considering the microscopic features of the device phenomena in the compact model, which had been previously treated only macroscopically.","PeriodicalId":6755,"journal":{"name":"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"6 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Compact Modeling Perspetive – Bridge to Industrial Applications\",\"authors\":\"M. Miura-Mattausch\",\"doi\":\"10.1109/SISPAD.2019.8870471\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper summarizes briefly compact-model development history, which is characterized by the evolution into the role as a bridge between devices and circuits. It is demonstrated that the task of predicting circuitry performance accurately has been realized by considering the microscopic features of the device phenomena in the compact model, which had been previously treated only macroscopically.\",\"PeriodicalId\":6755,\"journal\":{\"name\":\"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)\",\"volume\":\"6 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SISPAD.2019.8870471\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2019.8870471","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Compact Modeling Perspetive – Bridge to Industrial Applications
This paper summarizes briefly compact-model development history, which is characterized by the evolution into the role as a bridge between devices and circuits. It is demonstrated that the task of predicting circuitry performance accurately has been realized by considering the microscopic features of the device phenomena in the compact model, which had been previously treated only macroscopically.
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