W. Lee, A. Waite, H. Nii, H. Nayfeh, V. McGahay, H. Nakayama, D. Fried, H. Chen, L. Black, R. Bolam, J. Cheng, D. Chidambarrao, C. Christiansen, M. Cullinan-Scholl, D.R. Davies, A. Domenicucci, P. Fisher, J. Fitzsimmons, J. Gill, M. Gribelyuk, D. Harmon, J. Holt, K. Ida, M. Kiene, J. Kluth, C. Labelle, A. Madan, K. Malone, P. Mclaughlin, M. Minami, D. Mocuta, R. Murphy, C. Muzzy, M. Newport, S. Panda, I. Peidous, A. Sakamoto, T. Sato, G. Sudo, H. vanMeer, T. Yamashita, H. Zhu, P. Agnello, G. Bronner, G. Freeman, S. Huang, T. Ivers, S. Luning, K. Miyamoto, H. Nye, J. Pellerin, K. Rim, D. Schepis, T. Spooner, X. Chen, M. Khare, M. Horstmann, A. Wei, T. Kammler, J. Hontschel, H. Bierstedt, H. Engelmann, A. Hellmich, K. Hempel, G. Koerner, A. Neu, R. Otterbach, C. Reichel, M. Trentsch, P. Press, K. Frohberg, M. Schaller, H. Salz, J. Hohage, H. Ruelke, J. Klais, M. Raab, D. Greenlaw, N. Kepler
{"title":"高性能65nm SOI技术，具有增强的晶体管应变和先进的低k BEOL","authors":"W. Lee, A. Waite, H. Nii, H. Nayfeh, V. McGahay, H. Nakayama, D. Fried, H. Chen, L. Black, R. Bolam, J. Cheng, D. Chidambarrao, C. Christiansen, M. Cullinan-Scholl, D.R. Davies, A. Domenicucci, P. Fisher, J. Fitzsimmons, J. Gill, M. Gribelyuk, D. Harmon, J. Holt, K. Ida, M. Kiene, J. Kluth, C. Labelle, A. Madan, K. Malone, P. Mclaughlin, M. Minami, D. Mocuta, R. Murphy, C. Muzzy, M. Newport, S. Panda, I. Peidous, A. Sakamoto, T. Sato, G. Sudo, H. vanMeer, T. Yamashita, H. Zhu, P. Agnello, G. Bronner, G. Freeman, S. Huang, T. Ivers, S. Luning, K. Miyamoto, H. Nye, J. Pellerin, K. Rim, D. Schepis, T. Spooner, X. Chen, M. Khare, M. Horstmann, A. Wei, T. Kammler, J. Hontschel, H. Bierstedt, H. Engelmann, A. Hellmich, K. Hempel, G. Koerner, A. Neu, R. Otterbach, C. Reichel, M. Trentsch, P. Press, K. Frohberg, M. Schaller, H. Salz, J. Hohage, H. Ruelke, J. Klais, M. Raab, D. Greenlaw, N. Kepler","doi":"10.1109/IEDM.2005.1609265","DOIUrl":null,"url":null,"abstract":"A high performance 65 nm SOI CMOS technology is presented. Dual stress liner (DSL), embedded SiGe, and stress memorization techniques are utilized to enhance transistor speed. Advanced-low-K BEOL for this technology features 10 wiring levels with a novel K=2.75 film in selected levels. This film is a SiCOH-based dielectric optimized for stress to enable integration for enhanced performance. The resulting technology delivers pFET and nFET AC switching on-current of 735 muA/mum and 1259 muA/mum respectively, at an off-current of 200 nA/um (Vdd=1.0 V), and 6% reduction in interconnect delay. Process yield is demonstrated on a SRAM cell with size of 0.65 mum2","PeriodicalId":13071,"journal":{"name":"IEEE InternationalElectron Devices Meeting, 2005. 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Khare, M. Horstmann, A. Wei, T. Kammler, J. Hontschel, H. Bierstedt, H. Engelmann, A. Hellmich, K. Hempel, G. Koerner, A. Neu, R. Otterbach, C. Reichel, M. Trentsch, P. Press, K. Frohberg, M. Schaller, H. Salz, J. Hohage, H. Ruelke, J. Klais, M. Raab, D. Greenlaw, N. Kepler\",\"doi\":\"10.1109/IEDM.2005.1609265\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A high performance 65 nm SOI CMOS technology is presented. Dual stress liner (DSL), embedded SiGe, and stress memorization techniques are utilized to enhance transistor speed. Advanced-low-K BEOL for this technology features 10 wiring levels with a novel K=2.75 film in selected levels. This film is a SiCOH-based dielectric optimized for stress to enable integration for enhanced performance. The resulting technology delivers pFET and nFET AC switching on-current of 735 muA/mum and 1259 muA/mum respectively, at an off-current of 200 nA/um (Vdd=1.0 V), and 6% reduction in interconnect delay. 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引用次数: 59
摘要
提出了一种高性能65nm SOI CMOS技术。采用双应力线性线(DSL)、嵌入式SiGe和应力记忆技术来提高晶体管的速度。该技术的先进低K BEOL具有10个布线水平，在选定的水平上具有新颖的K=2.75薄膜。该薄膜是基于二氧化硅的电介质，针对应力进行了优化，以实现集成以增强性能。由此产生的技术在200 nA/um (Vdd=1.0 V)的关断电流下提供了分别为735 muA/mum和1259 muA/mum的pet和net交流开关电流，互连延迟降低了6%。在尺寸为0.65 mum2的SRAM电池上演示了工艺产率
High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL
A high performance 65 nm SOI CMOS technology is presented. Dual stress liner (DSL), embedded SiGe, and stress memorization techniques are utilized to enhance transistor speed. Advanced-low-K BEOL for this technology features 10 wiring levels with a novel K=2.75 film in selected levels. This film is a SiCOH-based dielectric optimized for stress to enable integration for enhanced performance. The resulting technology delivers pFET and nFET AC switching on-current of 735 muA/mum and 1259 muA/mum respectively, at an off-current of 200 nA/um (Vdd=1.0 V), and 6% reduction in interconnect delay. Process yield is demonstrated on a SRAM cell with size of 0.65 mum2
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