Yong-Sung Kim, Sang-Hyeon Lee, S. Shin, Sung-hee Han, Ju-Yong Lee, Jin-woo Lee, J. Han, Seung-Chul Yang, J. Sung, Eujime Lee, B. Song, Dong-jun Lee, D. Bae, Won-suk Yang, Yang-Keun Park, Kyuhyun Lee, B. Roh, Taeyoung Chung, Kinam Kim, Wonshik Lee
{"title":"Local-damascene-finFET DRAM集成p/sup +/掺杂多晶硅栅极技术,用于sub-60nm器件世代","authors":"Yong-Sung Kim, Sang-Hyeon Lee, S. Shin, Sung-hee Han, Ju-Yong Lee, Jin-woo Lee, J. Han, Seung-Chul Yang, J. Sung, Eujime Lee, B. Song, Dong-jun Lee, D. Bae, Won-suk Yang, Yang-Keun Park, Kyuhyun Lee, B. Roh, Taeyoung Chung, Kinam Kim, Wonshik Lee","doi":"10.1109/IEDM.2005.1609338","DOIUrl":null,"url":null,"abstract":"We integrate FinFET DRAM in sub-60nm feature size. To avoid severe passing gate effects in FinFET cell array, we introduce a local damascene gate structure. Threshold voltage control of the ultra thin body transistors is successfully achieved by adopting p+ boron in-situ doped poly-silicon gate on the FinFET cells. As a result, very stable and uniform operation of FinFET cells is realized. The local damascene FinFET with p+ gate can become a highly feasible mainstream DRAM technology for sub-60nm low-power high-speed devices","PeriodicalId":13071,"journal":{"name":"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.","volume":"21 1","pages":"315-318"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Local-damascene-finFET DRAM integration with p/sup +/ doped poly-silicon gate technology for sub-60nm device generations\",\"authors\":\"Yong-Sung Kim, Sang-Hyeon Lee, S. Shin, Sung-hee Han, Ju-Yong Lee, Jin-woo Lee, J. Han, Seung-Chul Yang, J. Sung, Eujime Lee, B. Song, Dong-jun Lee, D. Bae, Won-suk Yang, Yang-Keun Park, Kyuhyun Lee, B. Roh, Taeyoung Chung, Kinam Kim, Wonshik Lee\",\"doi\":\"10.1109/IEDM.2005.1609338\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We integrate FinFET DRAM in sub-60nm feature size. To avoid severe passing gate effects in FinFET cell array, we introduce a local damascene gate structure. Threshold voltage control of the ultra thin body transistors is successfully achieved by adopting p+ boron in-situ doped poly-silicon gate on the FinFET cells. As a result, very stable and uniform operation of FinFET cells is realized. The local damascene FinFET with p+ gate can become a highly feasible mainstream DRAM technology for sub-60nm low-power high-speed devices\",\"PeriodicalId\":13071,\"journal\":{\"name\":\"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.\",\"volume\":\"21 1\",\"pages\":\"315-318\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-12-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2005.1609338\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2005.1609338","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Local-damascene-finFET DRAM integration with p/sup +/ doped poly-silicon gate technology for sub-60nm device generations
We integrate FinFET DRAM in sub-60nm feature size. To avoid severe passing gate effects in FinFET cell array, we introduce a local damascene gate structure. Threshold voltage control of the ultra thin body transistors is successfully achieved by adopting p+ boron in-situ doped poly-silicon gate on the FinFET cells. As a result, very stable and uniform operation of FinFET cells is realized. The local damascene FinFET with p+ gate can become a highly feasible mainstream DRAM technology for sub-60nm low-power high-speed devices