碳纳米管触点与Cu damascene顶部金属化的电学改进

M. H. van der Veen, Y. Barbarin, B. Vereecke, Masahito Sugiura, Y. Kashiwagi, D. Cott, C. Huyghebaert, Z. Tokei
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引用次数: 8

摘要

我们讨论了在200mm晶圆上填充碳纳米管(CNT)和Cu damascene顶部金属的150nm直径触点的电学特性和性能的改进。平行触点和单触点的良率曲线非常吻合,表明得到了可靠的电学表征。我们证明,集成改变显著提高了碳纳米管接触的电阻率,将其从11.8·103 μΩ·cm降低到5.1·103 μΩ·cm。最后,使用碳纳米管触点的长度缩放来找到降低单个碳纳米管触点电阻的单个贡献者。
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Electrical improvement of CNT contacts with Cu damascene top metallization
We discuss the improvement in the electrical characterization and the performance of 150 nm diameter contacts filled with carbon nanotubes (CNT) and a Cu damascene top metal on 200mm wafers. The excellent agreement between the yield curves for the parallel and single contacts shows that a reliable electrical characterization is obtained. We demonstrate that integration changes improved the resistivity of the CNT contact significantly by reducing it from 11.8·103 μΩ·cm down to 5.1·103 μΩ·cm. Finally, a length scaling of the CNT contacts was used to find the individual contributors to the lowering of the single CNT contact resistance.
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